IP Library › Assignment 017003/0370
Patent Assignment
Reel/Frame 017003/0370

Assignment of Assignor's Interest

Recorded: 2005-11-10 Pages: 3
Assignors
CHOU, CHIU-MING
Executed: 2005-08-08
LIN, MOU-SHIUNG
Executed: 2005-08-08
Assignee
MEGIC CORPORATION
21 R&D FIRST ROAD, SCIENCE BASED INDUSTRIAL PARK, HSIN-CHU, R.O.C., TAIWAN
Covered Property (1)
Structure of Gold Bumps and Gold Conductors on One Ic Die and Methods of Manufacturing the Structures
Patent: 7,465,654 →
Application: 11/178,541 →
Publication: US 2006/0019490
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 3, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017566/0028 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →