Patent Assignment
Reel/Frame 017028/0008
Assignment of Assignor's Interest
Recorded: 2005-06-28
Pages: 2
Assignors
FUJI, YOSHIMARO
Executed: 2004-09-10
FUKUYO, FUMITSUGU
Executed: 2004-09-09
FUKUMITSU, KENSHI
Executed: 2004-09-09
UCHIYAMA, NAOKI
Executed: 2004-09-10
Assignee
HAMAMATSU PHOTONICS K.K.
1126-1, ICHINO-CHO, HAMAMATSU-SHI, SHIZUOKA 435-8558, JAPAN
Covered Property
(1)
Method for Dicing Substrate