Patent Assignment
Reel/Frame 017048/0969
Assignment of Assignor's Interest
Recorded: 2005-09-28
Pages: 3
Assignor
SUZUKI, KENJI
Executed: 2005-09-28
Assignee
TOKYO ELECTRON LIMITED
3-6 AKASAKA 5-CHOME, TBS BROADCAST CENTER, MINATO-KU, TOKYO, 107, JAPAN
Covered Property
(1)
Method for Integrating a Ruthenium Layer with Bulk Copper in Copper Metallization