Patent Assignment
Reel/Frame 017056/0787
Assignment of Assignor's Interest
Recorded: 2006-01-24
Pages: 2
Assignor
LEE, JUNE WOO
Executed: 2006-01-11
Assignee
DONGBUANAM SEMICONDUCTOR INC.
891-10, DAECHI-DONG, KANGNAM-KU, SEOUL, KOREA, REPUBLIC OF
Covered Property
(1)
Method of forming copper line in semiconductor device
Application:
11/319,341 →
Publication:
US 2006/0138670
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
May 22, 2006
From: DONGANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017654/0078 →
Corrective Assignment to Correct the Assignor Previously Recorded on Reel 017654 Frame 0078. Assignor(S) Hereby Confirms the Assignor Should Be "Dongbuanam Semiconductor Inc.".
Jun 22, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017829/0911 →