Patent Assignment
Reel/Frame 017056/0891
Assignment of Assignor's Interest
Recorded: 2006-01-24
Pages: 3
Assignors
CHEN, KE-HUNG
Executed: 2006-01-24
LIN, SHIH-HSIUNG
Executed: 2006-01-24
LIN, MOU-SHIUNG
Executed: 2006-01-24
Assignee
MEGIC CORPORATION
21, R&D 1ST. RD., SCIENCE-BASED INDUSTRIAL PARK HSINCHU, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Chip Package with Dam Bar Restricting Flow of Underfill
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 11, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017600/0649 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →