IP Library Assignment 017061/0608
Patent Assignment
Reel/Frame 017061/0608

Assignment of Assignor's Interest

Recorded: 2006-01-25 Pages: 4
Assignors
ENGLE, JASON
Executed: 2005-11-27
ABRIO, RHANDEE
Executed: 2006-01-12
BRADBURY-BENNETT, JULIE ROSLYN
Executed: 2005-12-18
ALLEE, GREG
Executed: 2006-01-12
KLEDZIK, KENNETH
Executed: 2005-11-21
Assignee
LEGACY ELECTRONICS, INC.
211 AVENIDA FABRICANTE, SAN CLEMENTE, CALIFORNIA, 92672
Covered Property (1)
Method and Apparatus for Fabricating a Circuit Board with a Three Dimensional Surface Mounted Array of Semiconductor Chips
Patent: 7,337,522 →
Application: 11/270,317 →
Publication: US 2006/0107524
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 31, 2012
From: LEGACY ELECTRONICS, INC.
To: LEGACY ELECTRONICS, INC.
Reel/Frame 029215/0894 →
Security Interest Jul 29, 2014
From: LEGACY ELECTRONICS, INC.
To: GIBRALTAR BUSINESS CAPITAL, LLC
Reel/Frame 033430/0982 →