Patent Assignment
Reel/Frame 017062/0045
Assignment of Assignor's Interest
Recorded: 2005-09-30
Pages: 2
Assignor
KANG, BYOUNG YOUNG
Executed: 2005-09-21
Assignee
DONGBUANAM SEMICONDUCTOR INC.
891-10, DAECHI-DONG, KANGNAM-GU, SEOUL, 135-280, KOREA, REPUBLIC OF
Covered Property
(1)
Image Sensor Chip Package and Method of Fabricating the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.