Patent Assignment
Reel/Frame 019800/0147
Change of Name
Recorded: 2007-09-07
Pages: 10
Assignor
DONGBUANAM SEMICONDUCTOR INC.
Executed: 2006-03-28
Assignee
DONGBU ELECTRONICS CO., LTD.
891-10 DAECHI-DONG, KANGNAM-KU, SEOUL, KOREA, REPUBLIC OF
Covered Properties
(27)
Methods of Manufacturing Semiconductor Devices
Methods of fabricating metal lines in semiconductor devices
Application:
11/027,517 →
Publication:
US 2005/0287796
Wet cleaning apparatus and methods
Application:
11/027,538 →
Publication:
US 2005/0268939
Method of Forming Pre-Metal Dielectric Layer
Method of pre-cleaning wafer for gate oxide formation
Application:
11/172,204 →
Publication:
US 2006/0003101
Method for Preventing a Metal Corrosion in a Semiconductor Device
Methods of Forming Shallow Trench Isolation Structures in Semiconductor Devices
Methods for Manufacturing Shallow Trench Isolation Layers of Semiconductor Devices
Non-volatile memory device and method for programming/erasing the same
Application:
11/196,641 →
Publication:
US 2006/0023506
Methods of forming gate electrodes in semiconductor devices
Application:
11/216,716 →
Publication:
US 2006/0046371
Method for cleaning semiconductor device having dual damascene structure
Application:
11/231,441 →
Publication:
US 2006/0063308
Image Sensor Chip Package and Method of Fabricating the Same
Wafer edge exposure method in semiconductor photolithographic processes, and orientation flatness detecting system provided with a WEE apparatus
Application:
11/254,296 →
Publication:
US 2007/0085988
Apparatus for cleaning wafer and method of pre-cleaning wafer for gate oxide formation
Application:
11/293,618 →
Publication:
US 2006/0137713
Field Transistor Monitoring Pattern for Shallow Trench Isolation Defects in Semiconductor Device
Method for forming lightly-doped-drain metal-oxide-semiconductor (LDD MOS) device
Application:
11/301,819 →
Publication:
US 2007/0105295
Method for fabricating a metal-insulator-metal capacitor
Application:
11/303,467 →
Publication:
US 2006/0160301
Method for forming a metal wiring in a semiconductor device
Application:
11/304,276 →
Publication:
US 2006/0128149
Method for Controlling a Vaporizer of Ion Implantation Equipment During Indium Implantation Process
Method of Fabricating a Floating Gate for a Nonvolatile Memory
Method for Forming an Intermetal Dielectric Layer Using Low-K Dielectric Material and a Semiconductor Device Manufactured Thereby
Method for Fabricating Self-Aligned Contact Hole
Split Gate Type Nonvolatile Memory Device and Manufacturing Method Thereof
Patent:
7,169,672 →
Application:
11/323,821 →
Antifuse Having Uniform Dielectric Thickness and Method for Fabricating the Same
Composite Pattern for Monitoring Various Defects of Semiconductor Device
Monitoring pattern for optimization of chemical mechanical polishing process of trench isolation layer and related methods
Application:
11/324,170 →
Publication:
US 2006/0148204
Reverse MOS (RMOS) transistor, and methods of making and using the same
Application:
11/324,171 →
Publication:
US 2006/0145184
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 30, 2004
From: PARK, TAE WON
To: DONGBUANAM SEMICONDUCTOR, INC.
Reel/Frame 016148/0589 →
Assignment of Assignor's Interest
Dec 30, 2004
From: KIM, DUK SOO
To: DONGBUANAM SEMICONDUCTOR, INC.
Reel/Frame 016151/0703 →
Assignment of Assignor's Interest
Dec 30, 2004
From: NAM, SANG WOO
To: DONGBUANAM SEMICONDUCTOR, INC.
Reel/Frame 016151/0426 →
Assignment of Assignor's Interest
May 10, 2005
From: LEE, JAE SUK
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016560/0934 →
Assignment of Assignor's Interest
Jun 29, 2005
From: YIM, TERESA
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016753/0424 →
Assignment of Assignor's Interest
Jun 29, 2005
From: HOH, YONG SU
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016753/0415 →
Assignment of Assignor's Interest
Jun 29, 2005
From: SEO, BYOUNG YOON
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016753/0420 →
Assignment of Assignor's Interest
Jul 11, 2005
From: LEE, JAE SUK
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016777/0283 →
Assignment of Assignor's Interest
Jul 13, 2005
From: LEE, JAE SUK
To: DONGBUANAM SEMICONDUCTOR, INC.
Reel/Frame 016782/0518 →
Assignment of Assignor's Interest
Aug 1, 2005
From: JO, BO YEOUN
To: DONGBUANAM SEMICONDUCTOR, INC., A KOREAN CORPORATION
Reel/Frame 016861/0461 →
Assignment of Assignor's Interest
Aug 2, 2005
From: JUNG, JIN HYO
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016861/0092 →
Assignment of Assignor's Interest
Aug 31, 2005
From: MOON, JAE YUHN
To: DONGBUANAM SEMICONDUCTOR, INC., A KOREAN CORPORATION
Reel/Frame 016952/0542 →
Assignment of Assignor's Interest
Sep 19, 2005
From: SHIM, JOON BUM
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017028/0672 →
Assignment of Assignor's Interest
Sep 30, 2005
From: KANG, BYOUNG YOUNG
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017062/0045 →
Assignment of Assignor's Interest
Oct 19, 2005
From: KIM, OOK HYUN
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017123/0470 →
Assignment of Assignor's Interest
Dec 2, 2005
From: KIM, WAN SHICK
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017334/0212 →
Assignment of Assignor's Interest
Dec 2, 2005
From: YOO, HUNG RYUL; KIM, SUN JU
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017334/0227 →
Assignment of Assignor's Interest
Dec 12, 2005
From: KIM, DAE KYEUN
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017367/0621 →
Assignment of Assignor's Interest
Dec 13, 2005
From: KIM, HYOUNG YOON
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017384/0950 →
Assignment of Assignor's Interest
Dec 13, 2005
From: KIM, SANG BUM
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017384/0985 →
Assignment of Assignor's Interest
Dec 23, 2005
From: YOON, CHUL JIN
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017415/0400 →
Assignment of Assignor's Interest
Dec 23, 2005
From: KIM, HYOUNG YOON
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017416/0573 →
Assignment of Assignor's Interest
Oct 15, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034009/0157 →
Corrective Assignment to Correct Remove Patent No. 878209 from Exhibit B Previously Recorded at Reel: 034009 Frame: 0157. Assignor(S) Hereby Confirms the Assignment.
Oct 24, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034087/0097 →
Assignment of Assignor's Interest
Feb 24, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041373/0956 →