Patent Assignment
Reel/Frame 017416/0573
Assignment of Assignor's Interest
Recorded: 2005-12-23
Pages: 2
Assignor
KIM, HYOUNG YOON
Executed: 2005-12-21
Assignee
DONGBUANAM SEMICONDUCTOR INC.
891-10, DAECHI-DONG, GANGNAM-GU, SEOUL, 135-280, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Forming an Intermetal Dielectric Layer Using Low-K Dielectric Material and a Semiconductor Device Manufactured Thereby
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Sep 7, 2007
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 019800/0147 →
Merger and Change of Name
Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →
Change of Name
Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →