Patent Assignment
Reel/Frame 034087/0097
Corrective Assignment to Correct Remove Patent No. 878209 from Exhibit B Previously Recorded at Reel: 034009 Frame: 0157. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2014-10-24
Pages: 31
Assignor
DONGBU HITEK, CO., LTD.
Executed: 2014-10-08
Assignee
INPHI CORPORATION
2953 BUNKER HILL LANE, SUITE 300, SANTA CLARA, CALIFORNIA, 95054
Covered Properties
(199)
Method of Manufacturing a Multi-Chip Semiconductor Package
Method for Manufacturing a Silicide Layer of Semiconductor Device
Method for Formation of Copper Diffusion Barrier Film Using Aluminum
Split-Gate Flash Memory Cell and Manufacturing Method Thereof
Method for Forming Isolation Layer in Semiconductor Device
Method of Fabricating Mask Rom
Transistor Fabrication Method
Semiconductor Device and Method for Fabricating the Same
Method for Forming Metal Lines of Semiconductor Device
Method for Fabricating a Semiconductor Device
Method of Fabricating Flash Eeprom
Micro-Pattern Forming Method for Semiconductor Device
Semiconductor Device and Fabrication Method Thereof
Semiconductor Devices and Methods for Forming Semiconductor Devices
Fabrication Method of Semiconductor Device
Method of Forming a Dual Damascene Pattern in a Semiconductor Device
Image Sensor and Method of Manufacturing the Same
Methods of Manufacturing Semiconductor Memory Devices
Flash Memory and Fabrication Method Thereof
Method for Fabricating Flash Memory Device
Method for Fabricating Transistor of Semiconductor Device
Flash Memory Device and Method for Fabricating the Same, and Programming and Erasing Method Thereof
Semiconductor Device Employing Soi Substrate and Method of Manufacturing the Same
Complementary Metal Oxide Semiconductor Image Sensor and Method for Fabricating the Same
Methods of Forming Silicon Quantum Dots and Methods of Fabricating Semiconductor Memory Devices Using the Same
Semiconductor Devices Having a via Hole and Methods for Forming a via Hole in a Semiconductor Device
Field Insulator Fet Device and Fabrication Method Thereof
Methods for Fabricating a Copper Interconnect
Semiconductor Device and Method for Fabricating the Same
Methods for Planarizing a Metal Layer
Methods for Forming a Device Isolation Structure in a Semiconductor Device
Methods for Forming a Field Effect Transistor
Semiconductor Devices Having a Capacitor and Methods of Manufacturing the Same
Flash Memory Devices and Methods of Fabricating the Same
Cmos Image Sensor with Dark Current Reduction
Non-Volatile Memory Devices and Methods of Fabricating the Same
Semiconductor Devices and Methods of Manufacturing the Same
Methods of Forming Metal Interconnection Lines in Semiconductor Devices
Methods for Fabricating Semiconductor Devices
Trench Isolation Method in Flash Memory Device
Method of Manufacturing Cmos Transistor by Using Soi Substrate
Methods of Forming a Pattern for a Semiconductor Device
Semiconductor Device and Method for Fabricating the Same
Mos Transistors and Methods of Manufacturing the Same
Self-Aligned Element Isolation Film Structure in a Flash Cell and Forming Method Thereof
Method of Manufacturing Semiconductor Device
Semiconductor Device and Method of Manufacturing the Same
Cmos Image Sensor and Method for Fabricating the Same
Method of Fabricating Gate Electrode of Semiconductor Device
Method for Forming Sti of Semiconductor Device
Method for Forming Metal Wirings of Semiconductor Device
Semiconductor Device and Method for Fabricating the Same
Method of Forming Metal Wiring of Semiconductor Device
Dual Damascene Interconnection in Semiconductor Device and Method for Forming the Same
Method for Forming Dual Damascene Interconnection in Semiconductor Device
Method for Etching Upper Metal of Capacitator
Semiconductor Device and Fabricating Method Thereof
Methods of Fabricating Nonvolatile Memory Device
Method for Forming Contact Hole for Dual Damascene Interconnection in Semiconductor Device
Active Cell Isolation Body of a Semiconductor Device and Method for Forming the Same
Method for Fabricating Metal Wirings of Semiconductor Device
Method of Fabricating Gate Electrode of Semiconductor Device
Methods of Fabricating Nonvolatile Memory Using a Quantum Dot
Semiconductor Interconnection Line and Method of Forming the Same
Methods of Fabricating Gate Spacers for Semiconductor Devices
Semiconductor Devices and Method for Fabricating the Same
Methods for Preventing Copper Oxidation in a Dual Damascene Process
Methods of Manufacturing Multi-Level Metal Lines in Semiconductor Devices
Transistors and Manufacturing Methods Thereof
Semiconductor Devices and Methods for Fabricating the Same Including Forming an Amorphous Region in an Interface Between a Device Isolation Layer and a Source/Drain Diffusion Layer
Methods of Forming Silicon Quantum Dots and Methods of Fabricating Semiconductor Memory Device Using the Same
Methods for Fabricating an Sti Film of a Semiconductor Device
Method for Fabricating Flash Memory Device
Method for Manufacturing Semiconductor Device
Semiconductor Device and Method for Fabricating the Same
Methods for Fabricating a Metal Layer Pattern
Method for Fabricating Semiconductor Device and Semiconductor Device Using the Same
Method for Fabricating Shallow Trench Isolation Layer of Semiconductor Device
Method for Fabricating Metal Line in a Semiconductor
Method for Fabricating Cell Transistor of Flash Memory
Method for Forming Device Isolation Layer of Semiconductor Device
Method for Monitoring Micro-Lens Curvature In-Line
Cmos Image Sensor and Method for Fabricating the Same
Method of Manufacturing a Sonos Device
Method for Forming Metal Interconnection of Semiconductor Device
Nor-Type Flash Memory Device and Manufacturing Method Thereof
Semiconductor Device and Manufacturing Method Thereof
Method of Fabricating a Floating Gate for a Nonvolatile Memory
Method of Fabricating Low-Power Cmos Device
Cmos Image Sensor and Method for Fabricating the Same
Cmos Image Sensor and Method for Fabricating the Same
Fabricating Method of Cmos Image Sensor
Image Sensor Including Microlens Having Sizes Differing According to Deposition of Color Filter Array
Semiconductor Device Having Silicide-Blocking Layer and Fabrication Method Thereof
Method for Forming a Plurality of Metal Lines in a Semiconductor Device Using Dual Insulating Layer
Method of Manufacturing an Isolation Layer of a Flash Memory
Method for Forming Floating Gate in Flash Memory Device
Flash Memory Device and Method for Fabricating the Same
Cmos Image Sensor and Method of Manufacturing the Same
Fabricating Method of Semiconductor Device
Cylinder-Type Capacitor and Storage Device, and Method(S) for Fabricating the Same
Methods of Manufacturing Semiconductor Devices
Method for Manufacturing Semiconductor Device
Method for Manufacturing Flash Memory Device
Semiconductor Device and Method of Fabricating the Same
Semiconductor Device and Manufacturing Method Thereof
Flash Memory Device and Method for Manufacturing the Same
Method for Forming Void-Free Trench Isolation Layer
Digital Micromirror Device and Manufacturing Method Thereof
Method of Manufacturing Semiconductor Device
Semiconductor Device and a Method for Manufacturing the Same
Method of Fabricating a Thin Film and Metal Wiring in a Semiconductor Device
Semiconductor Device and Method of Manufacturing the Same
Method of Manufacturing Eeprom Device
Cmos Image Sensor and Method for Manufacturing the Same
Metal Interconnection of Semiconductor Device and Method for Forming the Same
Transistor Device and Method for Manufacturing the Same
Transistor of Semiconductor Device and Method for Fabricating the Same
Method for Forming Shallow Trench Isolation of Semiconductor Device
Method for Forming Gate Dielectric Layers
Method for Fabricating a Thin Film and a Metal Line of a Semiconductor Device
Method of Forming Floating Gate Array of Flash Memory Device
Method for Fabricating a Thin Film and Metal Line of Semiconductor Device
Method of Manufacturing Split Gate Type Non-Volatile Memory Device
Narrow Width Metal Oxide Semiconductor Transistor
Transistors and Manufacturing Methods Thereof
Method of Fabricating Flash Memory Device Using Sidewall Process
Semiconductor Device and Method for Fabricating the Same
Semiconductor Interconnection Line and Method of Forming the Same
Flash Memory and Methods of Fabricating the Same
Power Mosfet Including Inter-Source Connection Pattern
Level Shifter Having Single Voltage Source
Semiconductor Device
Method of Forming Inductor in Semiconductor Device
Flash Device and the Manufacturing Method
Field Insulator Fet Device and Fabrication Method Thereof
Method of Forming Metal Wiring in Semiconductor Device
Method of Forming Pre-Metal Dielectric Layer of Semiconductor Device
Flash Memory Devices and Methods of Fabricating the Same
Semiconductor Device with Non-Volatile Memory Function and Method of Manufacturing the Same
Image Sensor and Method for Manufacturing the Same
Image Sensor and Method for Manufacturing the Same
Cmos Image Sensor and Method for Manufacturing the Same
Semiconductor Device and Method of Fabricating the Same
Method for Manufacturing Image Sensor
Method for Designing Mask Including Forming a Mesh Dummy Pattern
Method of Forming U-Shaped Floating Gate with a Poly Meta-Stable Polysilicon Layer
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device Having a Dual Gate Electrode and Methods of Making the Same
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device and Manufacturing Method Thereof
Mim Capacitor and Method of Fabricating the Same
Image Sensor and Manufacturing Method Thereof
Image Sensor and Manufacturing Method Thereof
Image Sensor Comprising a Photodiode in a Crystalline Semiconductor Layer and Manufacturing Method Thereof
Semiconductor Device and Method for Manufacturing the Device
Semiconductor Device
Image Sensor for Minimizing a Dark Current and Method for Manufacturing the Same
Method for Manufacturing Semiconductor Device
Method for Manufacturing Semicondcutor Device
Semiconductor Device Having Vertical and Horizontal Type Gates and Method for Fabricating the Same
Semiconductor Device and Method for Manufacturing the Same
Semiconductor Device
Semiconductor Device and Method for Manufacturing the Same
Image Sensor and Method for Manufacturing the Same
Method of Opening Pad in Semiconductor Device
Multi-Bit Memory Cell Structure and Method of Manufacturing the Same
Semiconductor Device and Method for Fabricating the Same
Method of Predicting Substrate Current in High Voltage Device
Apparatus for Testing Memory Device
Image Sensor and Method for Manufacturing the Same
Image Sensor and Method for Manufacturing the Same
Image Sensor and Method for Manufacturing the Same
Semiconductor Chip Package and Method for Manufacturing Thereof
Flash Memory Device and Method for Manufacturing the Same
Narrow Width Metal Oxide Semiconductor Transistor
Nonvolatile Memory Device, Method of Manufacturing the Nonvolatile Memory Device, and Method of Manufacturing Flat Panel Display Device Provided with the Nonvolatile Memory Device
Method for Manufacturing Capacitor of Semiconductor Device
Method of Manufacturing Semiconductur Device
Semiconductor Device and Method of Manufacturing the Same
Image Sensor and Method for Manufacturing the Same
Image Sensor and Method for Manufacturing the Same
Semiconductor Device and Method for Manufacturing the Same
Mask and Method for Fabricating Semiconductor Device Using the Same
Poly-Emitter Type Bipolar Junction Transistor, Bipolar Cmos Dmos Device, and Manufacturing Methods of Poly-Emitter Type Bipolar Junction Transistor and Bipolar Cmos Dmos Device
Image Sensor and Method for Manufacturing the Same
A Method of Manufacturing a Piezoelectric Transistor
Image Sensor and Method for Manufacturing the Same
Method for Manufacturing Flash Memory Device
Image Sensor and Manufacturing Method of Image Sensor
Method for Fabricating Semiconductor Device
Method of Manufacturing Flash Memory Device
Semiconductor Device Including Air Gap
Method for Fabricating Pip Capacitor
Semiconductor Memory Device with Spacer Shape Floating Gate and Manufacturing Method of the Semiconductor Memory Device.
Method for Forming Copper Wiring in Semiconductor Device
Semiconductor Memory Cell, Method for Manufacturing the Same and Method for Operating the Same
Apparatus and Method for Measuring Characteristics of Semiconductor Device
Method for Manufacturing Semiconductor Flash Memory and Flash Memory Cell
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 15, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034009/0157 →
Assignment of Assignor's Interest
Feb 22, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041347/0334 →
Assignment of Assignor's Interest
Feb 22, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041347/0369 →
Assignment of Assignor's Interest
Feb 22, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041347/0391 →
Assignment of Assignor's Interest
Feb 22, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041347/0418 →
Assignment of Assignor's Interest
Feb 22, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041347/0432 →
Assignment of Assignor's Interest
Feb 22, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041347/0451 →
Assignment of Assignor's Interest
Feb 22, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041347/0465 →
Assignment of Assignor's Interest
Feb 22, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041347/0497 →
Assignment of Assignor's Interest
Feb 22, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041347/0511 →
Assignment of Assignor's Interest
Feb 22, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041347/0536 →
Assignment of Assignor's Interest
Feb 22, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041347/0559 →
Assignment of Assignor's Interest
Feb 22, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041342/0765 →
Assignment of Assignor's Interest
Feb 24, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041373/0383 →
Assignment of Assignor's Interest
Feb 24, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041377/0161 →
Assignment of Assignor's Interest
Feb 24, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041373/0490 →
Assignment of Assignor's Interest
Mar 3, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041465/0893 →
Assignment of Assignor's Interest
Jun 23, 2021
From: INPHI CORPORATION
To: MARVELL TECHNOLOGY CAYMAN I
Reel/Frame 056649/0823 →
Assignment of Assignor's Interest
Jun 25, 2021
From: MARVELL TECHNOLOGY CAYMAN I
To: CAVIUM INTERNATIONAL
Reel/Frame 057279/0519 →
Assignment of Assignor's Interest
Aug 27, 2021
From: CAVIUM INTERNATIONAL
To: MARVELL ASIA PTE LTD.
Reel/Frame 057336/0873 →