Transistor of semiconductor device and method for fabricating the same
View Patent ↗A transistor which may effectively control the short channel effect with a vertical transistor structure. This structure may prevent the degradation of a transistor's performance caused by the hot carrier effect. The transistor has a source region having a concentration of implanted impurity ions on a semiconductor substrate; a channel region having a cylindrical shape over the source region; a drain region formed over the channel region; a gate insulation layer formed over the source region, a side of the channel region, and the drain region; and a gate conductor extending over an upper portion and one side of the channel region.
1. A method for fabricating a transistor comprising:
forming a first source or drain region by a first ion implantation process on a semiconductor substrate;
depositing a first sacrificial layer over the semiconductor substrate, and dry etching a portion of the sacrificial layer to form a hole which exposes the first source or drain region;
depositing and flattening a first conducting layer over the first sacrificial layer to form a channel region filling the hole;
removing the first sacrificial layer;
forming a second sacrificial layer over the first source and drain region and the channel region;
performing a second ion implanting process on the channel region;
removing the second sacrificial layer;
forming a gate insulation layer over the channel region forming a gate conducting layer;
dry etching the gate conducting layer to form a gate conductor extending over an upper portion and one side of the channel region;
implanting ions to form a second source and drain region over the channel region;
forming an intercalary insulation layer over the semiconductor substrate;
etching the intercalary insulation layer to form contact holes exposing a portion of the first and second source and drain regions and the gate conductor; and
depositing and patterning a second conducting layer over the intercalary insulation layer to fill the contact holes.
2. The method according to claim 1 , wherein the flattening process for forming the channel region is a CMP process.
3. The method according to claim 1 , wherein the first and second sacrificial layers are removed by wet etching.
4. The method according to claim 1 , wherein the second sacrificial layer is used to protect the semiconductor substrate from the ion implantation process.
5. The method according to claim 1 , wherein the gate insulation layer is used as an etch stop layer during the etching of the gate conducting layer.
6. The method according to claim 1 , wherein the second ion implantation is used for controlling a threshold voltage of the transistor.
7. The method according to claim 1 , wherein the second ion implantation process is performed by implanting ions on a side of the channel region with an angle between 30° and 60° with respect to a top surface of the semiconductor substrate.
8. The method according to claim 1 , wherein the first sacrificial layer has a thickness equal to a length of the channel of the transistor.