Image sensor and method for manufacturing the same
View Patent ↗Provided are an image sensor and a method for manufacturing the same. According to an embodiment, a semiconductor substrate is provided comprising a readout circuit. An interconnection electrically connected to the readout circuit and an interlayer dielectric are disposed over the semiconductor substrate. An image sensing unit is disposed over the interlayer dielectric and comprises a first doping layer and a second doping layer stacked therein. A first via hole is formed, exposing the interconnection through the image sensing unit. A fourth metal contact is formed in the first via hole to electrically connect the interconnection and the first doping layer. A fifth metal contact is formed over the fourth metal contact, the fifth metal contact being electrically insulated from the fourth metal contact and electrically connected to the second doping layer.
1. An image sensor comprising:
a semiconductor substrate comprising a readout circuit;
an interconnection connected to the readout circuit and an interlayer dielectric over the semiconductor substrate;
an image sensing unit over the interlayer dielectric, the image sensing unit comprising a first doping layer and a second doping layer stacked therein;
a first via hole exposing the interconnection through the image sensing unit;
a fourth metal contact in the first via hole to electrically connect the interconnection and the first doping layer; and
a fifth metal contact over the fourth metal contact, the fifth metal contact being electrically insulated from the fourth metal contact and electrically connected to the second doping layer.
2. The image sensor according to claim 1 , further comprising a pixel separation region penetrating the image sensing unit to separate the image sensing unit by unit pixel, the pixel separation region being formed adjacent to the fourth metal contact and the fifth metal contact.
3. The image sensor according to claim 2 , further comprising a fifth metal line formed over the fifth metal contact and electrically connected to the fifth metal contact.
4. The image sensor according to claim 3 , wherein fifth metal line is formed in a mesh pattern according to a formation position of the pixel separation region.
5. The image sensor according to claim 1 , further comprising a first barrier pattern on sidewalls of the first via hole while exposing a portion of the first doping layer and covering second doping layer and the remaining portion of the first doping layer.
6. The image sensor according to claim 1 , further comprising a second barrier pattern between the fourth metal contact and the fifth metal contact.
7. The image sensor according to claim 6 , wherein the fifth metal contact is formed in a trench exposing a portion of the second doping layer and the second barrier pattern.