CMOS image sensor and method for manufacturing the same
View Patent ↗Embodiments relate to a Complementary Metal Oxide Semiconductor (CMOS) image sensor, and to a method for manufacturing the same, that improves the low-light level characteristics of the CMOS image sensor. The CMOS image sensor has a photosensor unit and a signal processing unit, and may include a semiconductor substrate having a device isolating implant area provided with a first ion implant area and a complementary second ion implant area within the first ion implant area; a device isolating layer in the signal processing unit; a photodiode in the photosensor unit; and transistors in the signal processing unit. A crystal defect zone neighboring the photodiode may be minimized using the device isolating implant area between adjacent photodiodes so that a source of dark current can be reduced and the occurrence of interface traps can be prevented, making it possible to improve the low-light level characteristics of the image sensor.
1. A CMOS image sensor, comprising:
a semiconductor substrate having a photosensor unit and a device isolating implant area comprising a first ion implant area and a complementary second ion implant area within the first ion implant area, a first depletion layer at a junction location of the first ion implant area and the second ion implant area, and a second depletion layer at a junction location of the second ion implant area and the semiconductor substrate, wherein the second depletion layer has a greater thickness than the first depletion layer;
a device isolating layer in a signal processing unit on the semiconductor substrate;
a photodiode in the photosensor unit; and
transistors in the signal processing unit.
2. The CMOS image sensor according to claim 1 , wherein the first ion implant area comprises a p-type dopant, and the second ion implant area comprises an n-type dopant.
3. The CMOS image sensor according to claim 1 , wherein the semiconductor substrate comprises a p-type epitaxial silicon layer.
4. The CMOS image sensor according to claim 1 , further comprising a contact electrode connected to the second ion implant area, configured to apply a reverse voltage to the second ion implant area.
5. The CMOS image sensor according to claim 1 , wherein the second ion implant area is connected to a power source.
6. The CMOS image sensor according to claim 1 , wherein the second ion implant area is surrounded by the first ion implant area.
7. The CMOS image sensor according to claim 1 , wherein the photodiode is divided into at least two areas by the device isolating implant area.
8. The CMOS image sensor according to claim 1 , wherein the photosensor unit comprises photodiodes for at least two unit pixels, the respective unit pixels comprising at least two transistors.
9. The CMOS image sensor according to claim 8 , wherein the device isolating implant area is formed at boundary between adjacent unit pixels.
10. A method for manufacturing a CMOS image sensor having a photosensor unit and a signal processing unit, comprising the steps of: forming a device isolating layer in the signal processing unit in a semiconductor substrate; forming a preliminary device isolating implant area in the photosensor unit by forming a first ion implant area in the semiconductor substrate; completing a device isolating implant area by forming a complementary second ion implant area within the first ion implant area, a first depletion layer at a junction location of the first ion implant area and the second ion implant area, and a second depletion layer at a junction location of the second ion implant area and the semiconductor substrate, wherein the second depletion layer has a greater thickness than the first depletion layer; and forming a photodiode in the photosensor unit and transistors in the signal processing unit.
11. The method according to claim 10 , further comprising:
forming an insulating film on the photodiode and the transistors;
forming a contact hole in the insulating film exposing a surface of the second ion implant area; and
forming a contact in the contact hole electrically connected to the second ion implant area.
12. The method according to claim 10 , wherein a depletion layer of the device isolating implant area becomes deeper when a reverse voltage is applied to the second ion implant area.
13. The method according to claim 10 , wherein the first ion implant area comprises a p-type dopant, and the second ion implant area comprises an n-type dopant.
14. The method according to claim 11 , wherein a reverse voltage is applied to the contact.
15. The method according to claim 11 , wherein a power supply voltage is applied to the contact.
16. The method according to claim 10 , wherein the photosensor unit comprises photodiodes in at least two unit pixels, wherein each unit pixel comprises at least two transistors.
17. The method according to claim 16 , wherein the device isolating implant area is at the boundary between adjacent unit pixels.
18. A CMOS image sensor, comprising:
a semiconductor substrate having a photosensor unit and a device isolating implant area comprising a first ion implant area and a complementary second ion implant area within the first ion implant area, wherein the first ion implant area comprises a p-type dopant, and the second ion implant area comprises an n-type dopant;
a device isolating layer in a signal processing unit on the semiconductor substrate;
a photodiode in the photosensor unit; and
transistors in the signal processing unit.
19. The CMOS image sensor according to claim 18 , further comprising a contact electrode connected to the second ion implant area, configured to apply a reverse voltage to the second ion implant area.
20. The CMOS image sensor according to claim 18 , wherein the device isolating implant area is formed at boundary between adjacent unit pixels.