Semiconductor devices and methods of manufacturing the same
View Patent ↗Semiconductor devices and methods of manufacturing the same are disclosed. A disclosed semiconductor device comprises a semiconductor substrate; a gate formed on the semiconductor substrate; a gate oxide layer interposed between the semiconductor substrate and the gate; and source and drain regions formed within the substrate at opposite sides of the gate. The gate oxide layer has a first region with a first thickness and a second region with a second thickness. The second thickness is thicker than the first thickness.
1. A method of manufacturing a semiconductor device, comprising:
forming a mask pattern on a gate region of a semiconductor substrate;
forming a first oxide layer on an area of the semiconductor substrate exposed by the mask pattern, the first oxide layer having a first thickness and a tapered profile at an edge of the mask pattern;
removing the mask pattern to expose the gate region;
forming a second oxide layer on the gate region to form a gate oxide layer comprising the first and second oxide layers, the second oxide layer having a second thickness, the second thickness being less than the first thickness;
forming a gate material layer on the gate oxide layer,
forming a gate from the gate material layer, a first side of the gate overlapping the first oxide layer and a second side of the gate overlapping the second oxide layer; and
forming source and drain regions within the substrate at opposite sides of the gate.
2. A method as defined in claim 1 , wherein forming the gate comprises:
forming a second photoresist pattern on the gate material layer to offset the gate from the gate region;
etching the gate material layer using the second photoresist pattern as a mask; and
removing the second photoresist pattern.
3. A method as defined in claim 1 , wherein the source region is formed near the second oxide layer, and the drain region is formed near the first oxide layer.
4. A method as defined in claim 3 , wherein a boundary of the first and second oxide layers is arranged closer to the source region for greater gate driving voltages or greater drain voltages then for smaller gate driving voltages or smaller drain voltages.
5. A method as defined in claim 1 , wherein the mask pattern comprises a nitride layer.
6. A method as defined in claim 1 , wherein forming the mask pattern comprises depositing a silicon nitride layer to a thickness of approximately 500 Å.
7. A method as defined in claim 6 , wherein depositing the silicon nitride layer comprises a thermal treatment process or a plasma enhanced-chemical vapor deposition (PECVD) process.
8. A method as defined in claim 1 , wherein the second oxide layer is formed on the first oxide layer and on the gate region.
9. A method as defined in claim 1 , wherein forming the first oxide layer comprises growing a silicon oxide layer by a thermal treatment.
10. A method as defined in claim 9 , wherein oxygen penetrates the semiconductor substrate under an edge of the mask pattern during the thermal treatment, resulting in growth of the silicon oxide layer under the edge of the mask pattern.
11. A method as defined in claim 9 , wherein oxygen penetrates the semiconductor substrate under an edge of the mask pattern, resulting in a bird's bcak effect.