IP Library › Assignment 041347/0536
Patent Assignment
Reel/Frame 041347/0536

Assignment of Assignor's Interest

Recorded: 2017-02-22 Pages: 14
Assignor
DONGBU HITEK, CO., LTD.
Executed: 2014-10-08
Assignee
INPHI CORPORATION
2953 BUNKER HILL LANE, SUITE 300, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Method for Forming Metal Lines of Semiconductor Device
Patent: 6,716,735 →
Application: 10/327,858 →
Publication: US 2003/0124860
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 15, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034009/0157 →
Corrective Assignment to Correct Remove Patent No. 878209 from Exhibit B Previously Recorded at Reel: 034009 Frame: 0157. Assignor(S) Hereby Confirms the Assignment. Oct 24, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034087/0097 →
Assignment of Assignor's Interest Jun 23, 2021
From: INPHI CORPORATION
To: MARVELL TECHNOLOGY CAYMAN I
Reel/Frame 056649/0823 →
Assignment of Assignor's Interest Jun 25, 2021
From: MARVELL TECHNOLOGY CAYMAN I
To: CAVIUM INTERNATIONAL
Reel/Frame 057279/0519 →
Assignment of Assignor's Interest Aug 27, 2021
From: CAVIUM INTERNATIONAL
To: MARVELL ASIA PTE LTD.
Reel/Frame 057336/0873 →