IP Library › Granted Patent US 6,689,637
Granted Patent Utility Small
US 6,689,637 · Confirmation No. 7701

METHOD OF MANUFACTURING A MULTI-CHIP SEMICONDUCTOR PACKAGE

Inventor: Kye Chan Park
Patented Case View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2003-10-03 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-10-03 LET. Miscellaneous Incoming Letter 2 View
2003-10-03 DRW Drawings-only black and white line drawings 5 View
2002-06-12 TRNA Transmittal of New Application 3 View
2002-06-12 A.PE Preliminary Amendment 1 View
2002-06-12 SPEC Specification 12 View
2002-06-12 CLM Claims 6 View
2002-06-12 ABST Abstract 1 View
2002-06-12 DRW Drawings-only black and white line drawings 5 View
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Quick Facts
Patent No.
US 6,689,637
App. No.
10/167,558
Filed
2002-06-12
Granted
2004-02-10
Pub. No.
US20020192869A1
Art Unit
2824
PTA
-153 days