Patent Assignment
Reel/Frame 013174/0901
Assignment of Assignor's Interest
Recorded: 2002-08-12
Pages: 3
Assignor
PARK, KYE CHAN
Executed: 2002-06-25
Assignee
DONGBU ELECTRONICS CO., LTD.
891-10, DAECHI-DONG, KANGNAM-GU, SEOUL, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing a Multi-Chip Semiconductor Package
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Apr 14, 2005
From: DONGBU ELECTRONICS CO., LTD.
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016069/0777 →
Assignment of Assignor's Interest
Oct 15, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034009/0157 →
Corrective Assignment to Correct Remove Patent No. 878209 from Exhibit B Previously Recorded at Reel: 034009 Frame: 0157. Assignor(S) Hereby Confirms the Assignment.
Oct 24, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034087/0097 →
Assignment of Assignor's Interest
Feb 24, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041377/0161 →
Assignment of Assignor's Interest
Jun 23, 2021
From: INPHI CORPORATION
To: MARVELL TECHNOLOGY CAYMAN I
Reel/Frame 056649/0823 →
Assignment of Assignor's Interest
Jun 25, 2021
From: MARVELL TECHNOLOGY CAYMAN I
To: CAVIUM INTERNATIONAL
Reel/Frame 057279/0519 →
Assignment of Assignor's Interest
Aug 27, 2021
From: CAVIUM INTERNATIONAL
To: MARVELL ASIA PTE LTD.
Reel/Frame 057336/0873 →