Method of fabricating a thin film and metal wiring in a semiconductor device
View Patent ↗A method for forming a thin film of a semiconductor device, which may include at least one of the following steps: Forming a Tantalum Nitride (TaN) film over a semiconductor substrate by atomic layer deposition. Forming a Tantalum (Ta) film by converting at least a portion of a Tantalum Nitride (TaN) film into Tantalum (Ta) by soaking the TaN film in a diluted HNO 3 solution.
1. A method for forming a Tantalum Nitride (TaN) film over a semiconductor substrate; and
converting at least a portion of the Tantalum Nitride (TaN) film into a Tantalum (Ta) film.
2. The method of claim 1 , wherein the method forms a thin film in a semiconductor device.
3. The method of claim 1 , wherein said forming the Tantalum Nitride (TaN) film comprises forming the Tantalum Nitride (TaN) film through atomic layer deposition.
4. The method of claim 1 , wherein said converting comprises soaking the Tantalum Nitride (TaN) film in a diluted Nitric Acid (HNO 3 ) solution.
5. The method of claim 4 , wherein the concentration of the Nitric Acid (HNO 3 ) solution is less than approximately 1%.
6. The method of claim 1 , wherein said forming the Tantalum Nitride (TaN) film comprises forming the Tantalum Nitride (TaN) to have a thickness less than approximately 1 nanometer.
7. The method of claim 1 , wherein said forming the Tantalum Nitride (TaN) film and said converting the Tantalum Nitride (TaN) film are repeated at least two times.
8. The method of claim 7 wherein the total thicknesses of the Tantalum Nitride (TaN) films and the Tantalum (Ta) films is greater than approximately 10 Å and less than approximately 300 Å.
9. The method of claim 1 , wherein the thickness of the Tantalum (Ta) film and the thickness of the Tantalum Nitride (TaN) film are approximately the same.
10. The method of claim 1 , wherein said forming the Tantalum Nitride (TaN) comprises maintaining the substrate at a temperature greater than approximately 250° C. and less than 300° C.
11. A method of forming metal wiring in a semiconductor device, comprising:
forming an interlayer insulating film over a semiconductor substrate;
forming a trench in the interlayer insulating film;
forming a Tantalum Nitride (TaN) film over the interlayer insulating film and inside the trench;
converting at least a portion of the Tantalum Nitride (TaN) into a Tantalum (Ta) film; and
forming metal wiring over the Tantalum (Ta) film.
12. The method of claim 11 , wherein said forming the Tantalum Nitride (TaN) film comprises atomic layer deposition of Tantalum Nitride (TaN).
13. The method of claim 11 , wherein said converting at least a portion of the Tantalum Nitride (TaN) film into the Tantalum (Ta) film comprises soaking the semiconductor substrate in a Nitric Acid (HNO 3 ) solution.
14. The method of claim 13 , wherein the concentration of the Nitric Acid (HNO 3 ) solution is less than approximately 1%.
15. The method of claim 11 , wherein the Tantalum Nitride (TaN) film has a thickness less than approximately 1 nanometer.
16. The method of claim 11 , wherein said forming the Tantalum Nitride (TaN) film and said converting the Tantalum Nitride (TaN) film into the Tantalum (Ta) film are repeated at least two times.
17. The method of claim 16 , wherein the total thicknesses of the Tantalum Nitride (TaN) films and the Tantalum (Ta) films is greater than approximately 10 Å and less than approximately 300 Å.
18. The method of claim 11 , wherein the thickness of the Tantalum (Ta) film and the thickness of the Tantalum Nitride (TaN) film are approximately the same.
19. The method of claim 11 , wherein said forming the Tantalum Nitride (TaN) film comprises maintaining the substrate at a temperature greater than approximately 250° C. and less than 300° C.