Patent Assignment
Reel/Frame 041427/0074
Assignment of Assignor's Interest
Recorded: 2017-03-01
Pages: 14
Assignor
DONGBU HITEK, CO., LTD.
Executed: 2014-10-08
Assignee
INPHI CORPORATION
2953 BUNKER HILL LANE, SUITE 300, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Method of Fabricating a Thin Film and Metal Wiring in a Semiconductor Device
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 1, 2006
From: BAEK, IN-CHEOL; LEE, HAN-CHOON
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 018575/0081 →
Assignment of Assignor's Interest
Oct 15, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034009/0157 →
Corrective Assignment to Correct Remove Patent No. 878209 from Exhibit B Previously Recorded at Reel: 034009 Frame: 0157. Assignor(S) Hereby Confirms the Assignment.
Oct 24, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034087/0097 →
Assignment of Assignor's Interest
Jun 23, 2021
From: INPHI CORPORATION
To: MARVELL TECHNOLOGY CAYMAN I
Reel/Frame 056649/0823 →
Assignment of Assignor's Interest
Jun 25, 2021
From: MARVELL TECHNOLOGY CAYMAN I
To: CAVIUM INTERNATIONAL
Reel/Frame 057279/0519 →
Assignment of Assignor's Interest
Aug 27, 2021
From: CAVIUM INTERNATIONAL
To: MARVELL ASIA PTE LTD.
Reel/Frame 057336/0873 →