Semiconductor device including air gap
View Patent ↗Embodiments relate to a semiconductor device, and more particularly, to a semiconductor device and a manufacturing method thereof that can reduce RC delay within the semiconductor device. Embodiments provide a semiconductor device including: a first interlayer dielectric layer formed over the a semiconductor substrate, a first metal wire and a second metal wire formed over the first interlayer dielectric layer, a second interlayer dielectric layer formed over the first and second metal wires, and a phase change material layer formed between the first and second metal wires.
1. An apparatus comprising:
a first interlayer dielectric layer formed over a semiconductor substrate;
a first metal wire and a second metal wire formed over the first interlayer dielectric layer;
a second interlayer dielectric layer formed over the first and second metal wires;
a phase change material layer formed between the first and second metal wires; and
an air gap formed between the first interlayer dielectric layer and the second interlayer dielectric layer,
wherein the air gap is formed to surround an upper surface and side surfaces of the phase change material layer.
2. The apparatus of claim 1 , wherein the phase change material layer and the air gap are formed between the first metal wire and the second metal wire.
3. The apparatus of claim 1 , wherein the air gap is in a vacuum state.
4. The apparatus of claim 1 , wherein the first metal wire and the second metal wire are formed with an empty space interposed therebetween.
5. The apparatus of claim 1 , wherein the phase change material layer is made of a material selected from GaSb, InSb, InSe, Sb 2 Te 3 , and GeTe.
6. The apparatus of claim 1 , wherein the phase change material layer is made of a material selected from GeSbTe, GaSeTe, InSbTe, SnSb 2 Te 4 , and InSbGe.
7. The apparatus of claim 1 , wherein the phase change material layer is made of a material selected from AgInSbTe, (GeSn)SbTe, GeSb(SeTe), and Te 81 Ge 15 Sb 2 S 2 .
8. The apparatus of claim 1 , including contact plugs formed in the first interlayer dielectric layer.
9. The apparatus of claim 4 , wherein the empty space is in the vacuum state.
10. The apparatus of claim 8 , wherein the first and second metal wires are each connected to a contact plug.