Method for fabricating semiconductor device
View Patent ↗A method for fabricating a semiconductor device is disclosed. The method includes forming a first oxide film, a nitride film, and a second oxide film on a semiconductor substrate in succession, etching the second oxide film and the nitride film to form a second oxide film pattern and a nitride film pattern, exposing a portion of the first oxide film, performing at least one nitrogen implantation into the semiconductor substrate to form a nitrogen injection region under the exposed portion of the first oxide film, forming a third oxide film over the second oxide film pattern, the nitride film pattern, and the semiconductor substrate, forming a trench that is deeper than the nitrogen ion injection region by etching the semiconductor substrate using the second oxide film pattern as a mask, and filling the trench with an oxide film to form a device isolating film.
1. A method for fabricating a semiconductor device comprising the steps of:
forming a first oxide film, a nitride film, and a second oxide film on or over a semiconductor substrate in succession;
etching the second oxide film and the nitride film to form a second oxide film pattern and a nitride film pattern, exposing a portion of the first oxide film;
performing at least one nitrogen implantation to form a nitrogen injection region in the semiconductor substrate under the first oxide film;
forming a third oxide film on or over the second oxide film pattern, the nitride film pattern, and the semiconductor substrate;
forming a trench having a depth that is greater than a depth of by the nitrogen injection region by etching the third oxide film and the semiconductor substrate; and
filling the trench with an oxide film to form a device isolating film.
2. The method as claimed in claim 1 , wherein the step of performing at least one nitrogen implantation to form a nitrogen injection region comprises a plurality of nitrogen implantations, where an energy of a first nitrogen implantation is different from an energy of a second nitrogen implantation.
3. The method as claimed in claim 1 , wherein the step performing at least one nitrogen implantation to form a nitrogen injection region comprises:
first implanting nitrogen at a first dose of 1E15˜2E15 atoms/cm 2 at a first energy of 10˜15 KeV; and
second implanting nitrogen at a second dose of 1E15˜2E15 atoms/cm 2 at a second energy of 20˜25 KeV.
4. The method as claimed in claim 1 , wherein the second oxide film has a thickness greater than a thickness of the first oxide film.
5. The method as claimed in claim 1 , wherein the first oxide film, the second oxide film, and the third oxide film comprise TEOS.
6. The method as claimed in claim 1 , wherein the step of forming the trench comprises anisotropically etching the third oxide film to form a residual third oxide film at sidewalls of the second oxide film pattern and the nitride film pattern.
7. The method as claimed in claim 6 , wherein anisotropically etching the semiconductor substrate comprises using the residual portion of the third oxide film as an etch mask.
8. The method as claimed in claim 7 , wherein a residual portion of the nitrogen injection region remains along sidewalls of the trench after the trench is formed.
9. The method as claimed in claim 8 , wherein the residual portion of the nitrogen injection region is in an active region of the semiconductor substrate.
10. The method as claimed in claim 1 , wherein the trench has a width smaller than a width of the nitrogen injection region.
11. A method for fabricating a semiconductor device comprising:
forming a first insulating film pattern on a semiconductor substrate;
performing at least one nitrogen implantation into a portion of the semiconductor substrate using the first insulating film pattern as mask to form a nitrogen injection region;
forming a second insulating film at sidewalls of the first insulating film pattern;
forming a trench having a depth greater than the nitrogen injection region by anisotropically etching the semiconductor substrate using the first insulating film pattern and the second insulating film as a mask, to remove the nitrogen injection region except for a peripheral region of the nitrogen injection region along an upper sidewall of the trench; and
filling the trench with an oxide film to form a device isolating region.
12. The method as claimed in claim 11 , wherein performing at least one nitrogen implantation comprises:
performing a first nitrogen implantation at a first dose of 1E15˜2E15 atoms/cm 2 and at a first energy of 10˜15 KeV; and
performing a second nitrogen implantation at a second dose of 1E15˜2E15 atoms/cm 2 and at a second implantation energy of 20˜25 KeV.
13. The method as claimed in claim 11 , wherein performing at least one nitrogen implantation comprises a plurality of nitrogen implantations where a first nitrogen implantation energy differs from a second nitrogen implantation energy.
14. The method as claimed in claim 11 , wherein forming the trench comprises etching a portion of the second insulating film formed over a portion of the semiconductor substrate exposed by the first insulating film pattern.
15. The method as claimed in claim 14 , wherein a residual portion of the second insulating film remains at sidewalls of the first insulating film pattern after the trench is formed.
16. The method as claimed in claim 11 , wherein the peripheral region of the nitrogen injection region is in an active area of the semiconductor substrate.
17. The method as claimed in claim 11 , further comprising performing chemical mechanical polishing to remove a portion of the oxide film and expose the upper surface of the first insulating film pattern.
18. The method as claimed in claim 11 , wherein the first insulating film pattern comprises a first oxide film, a nitride film, and a second oxide film, and the second insulating film comprises a TEOS-based oxide.
19. A method for fabricating a semiconductor device comprising the steps of:
forming a first insulating film pattern on a semiconductor substrate;
performing a plurality of nitrogen implantations into a portion of the semiconductor substrate using the first insulating film pattern as mask to form a nitrogen injection region, where a first nitrogen implantation energy differs from a second nitrogen implantation energy;
forming a second insulating film at sidewalls of the first insulating film pattern;
forming a trench having a depth greater than the nitrogen injection region by anisotropically etching the semiconductor substrate using the first insulating film pattern and the second insulating film as a mask, to remove the nitrogen injection region except for a peripheral region of the nitrogen injection region along an upper sidewall of the trench; and
filling the trench with an oxide film to form a device isolating region.
20. The method as claimed in claim 19 , wherein forming the second insulating film comprises anisotropically etching an oxide film on the first insulating film pattern to leave an insulating spacer along the sidewalls of the first insulating film pattern.