Method for forming floating gate in flash memory device
View Patent ↗A method for fabricating a nonvolatile memory device including successively forming a first oxide layer, an electrically conductive layer, a second oxide layer, a nitride layer and a third oxide layer on a semiconductor substrate. The method also includes patterning the third oxide layer, forming spacers at sidewalls of the third oxide layer, forming a trench in the substrate by selectively etching the substrate with the third oxide layer as a mask, filling the trench with fourth oxide layer, and removing the third oxide layer, the nitride layer and the second oxide layer. Before filling the trench with the fourth oxide layer, a liner oxide layer is formed on inner walls of the trench. The fourth oxide layer is high density plasma (HDP) oxide and tetrafluoroethane (Si(OC 2 H 5 ) 4 ). During the filling the trench, lower corners of the conductive layer are made have rounded structure or bird's beak structure.
1. A method for fabricating a nonvolatile memory device, said method comprising the steps of:
successively forming a first oxide layer, an electrically conductive layer, a second oxide layer, a nitride layer and a third oxide layer on a semiconductor substrate;
patterning the third oxide layer;
forming spacers at sidewalls of third oxide layer;
forming a trench in the substrate by selectively etching the substrate with the third oxide layer as mask;
forming a liner oxide on inner walls of the trench;
filling the trench with a fourth oxide layer using a semi-recessed LOCOS process, while making lower corners of the conductive layer to have rounded structure, the fourth oxide layer functioning as an isolation layer; and
removing the third oxide layer, the nitride layer and the second oxide layer.
2. The method of claim 1 , wherein the step of removing the third oxide layer, the nitride layer and the second oxide layer is performed by chemical mechanical polishing (CMP) process.
3. The method of claim 1 , wherein the step of forming the trench is carried out by reactive ion etching.
4. The method of claim 1 , wherein the fourth oxide layer is made of high density plasma (HDP) oxide or tetrafluoroethane (Si(OC 2 H 5 ) 4 ).