Patent Assignment
Reel/Frame 017067/0658
Assignment of Assignor's Interest
Recorded: 2005-09-30
Pages: 3
Assignors
YU, CHEN-HUA
Executed: 2003-09-01
TSENG, HORNG-HUEI
Executed: 2003-09-01
JANG, SYUN-MING
Executed: 2003-09-01
HU, CHENMING
Executed: 2003-09-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, R.O.C., 300-77, TAIWAN
Covered Property
(1)
Interconnect with Composite Barrier Layers and Method for Fabricating the Same