Patent Assignment
Reel/Frame 017095/0189
Assignment of Assignor's Interest
Recorded: 2005-10-17
Pages: 3
Assignor
HORIE, MASANAO
Executed: 2005-08-25
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor Device Mounting Structure for Reducing Thermal Stress and Warpage
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 7, 2005
From: HORIE, MASANAO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017084/0033 →
Change of Name
Nov 11, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025346/0886 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →