Patent Assignment
Reel/Frame 017100/0411
Assignment of Assignor's Interest
Recorded: 2005-12-08
Pages: 3
Assignors
ARANA, LEONEL R.
Executed: 2005-11-28
NATEKAR, DEVENDRA
Executed: 2005-11-28
NEWMAN, MICHAEL
Executed: 2005-11-28
GURUMURTHY, CHARAN K.
Executed: 2005-11-28
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Method of Forming Through-Silicon Vias with Stress Buffer Collars and Resulting Devices