Patent Assignment
Reel/Frame 017111/0902
Assignment of Assignor's Interest
Recorded: 2005-05-26
Pages: 7
Assignors
NAKAMORI, MASAHIKO
Executed: 2005-05-20
SHIMOMURA, TETSUO
Executed: 2005-05-20
YAMADA, TAKATOSHI
Executed: 2005-05-20
OGAWA, KAZUYUKI
Executed: 2005-05-20
KAZUNO, ATSUSHI
Executed: 2005-05-20
WATANABE, KIMIHIRO
Executed: 2005-05-20
Assignee
TOYO TIRE & RUBBER CO., LTD.
17-18, EDOBORI 1-CHOME, NISHI-KU, OSAKA-SHI, OSAKA 550-8661, JAPAN
Covered Property
(1)
Polishing pad and method of producing semiconductor device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.