Patent Assignment
Reel/Frame 017147/0642
Assignment of Assignor's Interest
Recorded: 2005-10-26
Pages: 3
Assignors
KOGA, NORIHISA
Executed: 2005-10-14
KOGA, SHINJI
Executed: 2005-10-14
YOSHITAKA, NAOTO
Executed: 2005-10-14
NISHIYA, AKIRA
Executed: 2005-10-14
Assignee
TOKYO ELECTRON LIMITED
3-6, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-8481, JAPAN
Covered Property
(1)
Laser Processing Apparatus and Laser Processing Method for Cutting and Removing a Part of a Surface Region of a Substrate