Patent Assignment
Reel/Frame 017166/0897
Assignment of Assignor's Interest
Recorded: 2005-10-28
Pages: 5
Assignors
CHOU, CHIU-MING
Executed: 2005-10-25
CHOU, CHIEN-KANG
Executed: 2005-10-25
LIN, CHING-SAN
Executed: 2005-10-25
LIN, MOU-SHIUNG
Executed: 2005-10-25
Assignee
MEGIC CORPORATION
NO. 21, R&D 1ST. RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Property
(1)
Semiconductor Chip with Passivation Layer Comprising Metal Interconnect and Contact Pads
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 1, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017951/0456 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →