Patent Assignment
Reel/Frame 017951/0456
Assignment of Assignor's Interest
Recorded: 2006-06-01
Pages: 5
Assignor
MEGIC CORPORATION
Executed: 2006-03-01
Assignee
MEGICA CORPORATION
ROOM 301/302, NO. 47, PARK 2ND RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Properties
(16)
Metallization Structure Over Passivation Layer for Ic Chip
Chip Structure
Chip Structure with Redistribution Traces
Connection Between a Semiconductor Chip and a Circuit Component with a Large Contact Area
Over-Passivation Process of Forming Polymer Layer Over Ic Chip
Method for Fabricating Chip Structure
Semiconductor Chip with Passivation Layer Comprising Metal Interconnect and Contact Pads
Semiconductor Chip with Post-Passivation Scheme Formed Over Passivation Layer
Thick gold conductor on IC chip
Application:
60/588,595 →
Gold bump array on IC chip
Application:
60/623,553 →
Underfill dam on chip-on-chip assembly structure
Application:
60/647,129 →
On chip transformer
Application:
60/682,721 →
Very thick metal interconnection scheme in IC chip
Application:
60/684,815 →
Double embossing structure
Application:
60/701,849 →
Au landing pads with barrier Ni on IC pads
Application:
60/703,932 →
Au landing on IC pads
Application:
60/703,933 →
Related Assignments
(18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 12, 2005
From: LIN, MOU-SHIUNG; CHOU, CHIU-MING; CHOU, CHIEN-KANG; LO, HSIN-JUNG
To: MEGIC CORPORATION
Reel/Frame 016866/0126 →
Assignment of Assignor's Interest
Oct 3, 2005
From: LIN, MOU-SHIUNG
To: MEGIC CORPORATION
Reel/Frame 017041/0701 →
Assignment of Assignor's Interest
Oct 25, 2005
From: CHEN, YING-CHIH; LIN, MOU-SHIUNG; CHOU, CHIU-MING
To: MEGIC CORPORATION
Reel/Frame 017131/0358 →
Assignment of Assignor's Interest
Oct 28, 2005
From: CHOU, CHIU-MING; CHOU, CHIEN-KANG; LIN, CHING-SAN; LIN, MOU-SHIUNG
To: MEGIC CORPORATION
Reel/Frame 017166/0167 →
Assignment of Assignor's Interest
Oct 28, 2005
From: CHOU, CHIU-MING; CHOU, CHIEN-KANG; LIN, CHING-SAN; LIN, MOU-SHIUNG
To: MEGIC CORPORATION
Reel/Frame 017166/0897 →
Assignment of Assignor's Interest
Nov 22, 2005
From: LIN, MOU-SHIUNG
To: MEGIC CORPORATION
Reel/Frame 017234/0804 →
Assignment of Assignor's Interest
Dec 5, 2005
From: LIN, MOU-SHIUNG; CHOU, CHIU-MING
To: MEGIC CORPORATION
Reel/Frame 017713/0660 →
Assignment of Assignor's Interest
May 30, 2006
From: LIN, MOU-SHIUNG; CHOU, CHIEN-KANG; CHUO, CHIU-MING; LEE, WEN-CHIEH
To: MEGIC CORPORATION
Reel/Frame 017948/0801 →
Assignment of Assignor's Interest
May 30, 2006
From: LIN, MOU-SHIUNG; CHOU, CHIEN-KANG; LO, HSIN-JUNG; CHOU, CHIU-MING
To: MEGIC CORPORATION
Reel/Frame 017939/0254 →
Assignment of Assignor's Interest
May 30, 2006
From: LIN, MOU-SHIUNG; LO, HSIN-JUNG; CHOU, CHIEN-KANG; CHOU, CHIU-MING
To: MEGIC CORPORATION
Reel/Frame 017939/0173 →
Assignment of Assignor's Interest
May 30, 2006
From: LIN, MOU-SHIUNG; LIN, SHIH-HSIUNG; CHEN, KE-HUNG
To: MEGIC CORPORATION
Reel/Frame 017939/0185 →
Assignment of Assignor's Interest
May 30, 2006
From: LIN, MOU-SHIUNG; CHOU, CHIEN-KANG; CHOU, CHIU-MING
To: MEGIC CORPORATION
Reel/Frame 017939/0206 →
Assignment of Assignor's Interest
May 30, 2006
From: LIN, MOU-SHIUNG; CHOU, CHIEN-KANG; LO, HSIN-JUNG; CHOU, CHIU-MING
To: MEGIC CORPORATION
Reel/Frame 017939/0213 →
Assignment of Assignor's Interest
May 30, 2006
From: LIN, MOU-SHIUNG; LIN, CHING-SAN; CHOU, CHIEN-KANG; CHOU, CHIU-MING
To: MEGIC CORPORATION
Reel/Frame 017939/0220 →
Assignment of Assignor's Interest
May 30, 2006
From: LIN, MOU-SHIUNG; CHOU, CHIEN-KANG; CHOU, CHIU-MING
To: MEGIC CORPORATION
Reel/Frame 017948/0797 →
Assignment of Assignor's Interest
Jun 3, 2009
From: CHOU, CHIU-MING; CHOU, CHIEN-KANG; LIN, MOU-SHIUNG
To: MEGIC CORPORATION
Reel/Frame 022770/0608 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →