IP Library › Patent Application 60623553

Patent Application Provisional Small

App. No. 60/623,553 · Confirmation No. 1042

Gold bump array on IC chip

Inventors: Chiu-Ming Chou, Chien-Kang Chou, Ching-San Lin, Mou-Shiung Lin

Provisional Application Expired

⬇ PDF		Code	Description	Pages	PDF
	2006-06-15	`N570`	Communication - Re: Power of Attorney (PTOL-308)	2	View
	2006-05-30	`PA..`	Power of Attorney	2	View
	2004-10-29	`TRNA`	Transmittal of New Application	2	View
	2004-10-29	`SPEC`	Specification	6	View
	2004-10-29	`WFEE`	Fee Worksheet (SB06)	1	View

Inventors

Chiu-Ming Chou Kaohsiung City, TAIWAN

Chien-Kang Chou Tainan Hsien, TAIWAN

Ching-San Lin Wufong Township, TAIWAN

Mou-Shiung Lin Hsinchu, TAIWAN

Prosecution

Docket No.: JCLA15228-P
Confirmation No.: 1042

QUALCOMM INCORPORATED

from MEGIT ACQUISITION CORP.

ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded 2014-07-11

033303/0124 →

MEGICA CORPORATION

from MEGIC CORPORATION

ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded 2006-06-01

017951/0456 →

MEGIC CORPORATION

from CHOU, CHIEN-KANG, CHOU, CHIU-MING, LIN, CHING-SAN, LIN, MOU-SHIUNG, LIU, YI-CHENG

ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded 2006-05-30

017939/0220 →

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Quick Facts

App. No.: 60/623,553
Filed: 2004-10-29

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