IP Library › Assignment 017939/0220
Patent Assignment
Reel/Frame 017939/0220

Assignment of Assignor's Interest

Recorded: 2006-05-30 Pages: 6
Assignors
LIN, MOU-SHIUNG
Executed: 2006-03-01
LIN, CHING-SAN
Executed: 2006-03-01
CHOU, CHIEN-KANG
Executed: 2006-03-01
CHOU, CHIU-MING
Executed: 2006-03-01
LIU, YI-CHENG
Executed: 2006-03-01
Assignee
MEGIC CORPORATION
NO.21, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Property (1)
Gold bump array on IC chip
Application: 60/623,553 →
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 1, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017951/0456 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →