Patent Assignment
Reel/Frame 017234/0804
Assignment of Assignor's Interest
Recorded: 2005-11-22
Pages: 5
Assignor
LIN, MOU-SHIUNG
Executed: 2005-11-01
Assignee
MEGIC CORPORATION
NO. 21, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Property
(1)
Metallization Structure Over Passivation Layer for Ic Chip
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 1, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017951/0456 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →