IP Library › Assignment 022770/0608
Patent Assignment
Reel/Frame 022770/0608

Assignment of Assignor's Interest

Recorded: 2009-06-03 Pages: 3
Assignors
CHOU, CHIU-MING
Executed: 2005-06-15
CHOU, CHIEN-KANG
Executed: 2005-06-15
LIN, MOU-SHIUNG
Executed: 2005-06-15
Assignee
MEGIC CORPORATION
NO. 21, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property (1)
Connection Between a Semiconductor Chip and a Circuit Component with a Large Contact Area
Patent: 8,198,729 →
Application: 11/183,648 →
Publication: US 2006/0012041
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 1, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017951/0456 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →