Patent Assignment
Reel/Frame 017948/0797
Assignment of Assignor's Interest
Recorded: 2006-05-30
Pages: 4
Assignors
LIN, MOU-SHIUNG
Executed: 2006-03-01
CHOU, CHIEN-KANG
Executed: 2006-03-01
CHOU, CHIU-MING
Executed: 2006-03-01
Assignee
MEGIC CORPORATION
NO. 21, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Property
(1)
Very thick metal interconnection scheme in IC chip
Application:
60/684,815 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.