IP Library › Assignment 017182/0413
Patent Assignment
Reel/Frame 017182/0413

Assignment of Assignor's Interest

Recorded: 2006-01-12 Pages: 3
Assignors
COLBERT, JOHN LEE
Executed: 2005-12-20
HOFFMEYER, MARK KENNETH
Executed: 2005-12-20
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
High Performance Reworkable Heatsink and Packaging Structure with Solder Release Layer
Patent: 7,342,306 →
Application: 11/316,264 →
Publication: US 2007/0145574