Patent Assignment
Reel/Frame 017185/0980
Assignment of Assignor's Interest
Recorded: 2005-11-07
Pages: 7
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Methods of Forming Blind Wafer Interconnects
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.