IP Library Assignment 017243/0727
Patent Assignment
Reel/Frame 017243/0727

Assignment of Assignor's Interest

Recorded: 2005-11-16 Pages: 3
Assignors
SAKAI, JUN
Executed: 2005-10-19
INOUE, HIROBUMI
Executed: 2005-10-19
MOTONAGA, KAZUHIRO
Executed: 2005-10-19
Assignees
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, JAPAN
Covered Property (1)
Wiring Board Having Connecting Wiring Between Electrode Plane and Connecting Pad
Patent: 7,321,166 →
Application: 11/274,182 →
Publication: US 2006/0103004
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 11, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025346/0877 →