Patent Assignment
Reel/Frame 025346/0877
Change of Name
Recorded: 2010-11-11
Pages: 9
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Properties
(92)
Semiconductor Device
Interconnect Layout Method
Semiconductor Device
System-In-Package Type Semiconductor Device
Semiconductor Device
Semiconductor Apparatus with an Analog-to-Digital Converter and Amplifier
Information Processing Apparatus
Oscillation Apparatus Capable of Compensating for Fluctuation of Oscillation Frequency
Movable-Type Flatness Measurement Apparatus
Semiconductor Device Including Metal-Insulator-Metal Capacitor Arrangement
Semiconductor Device with a/D Converter
Decoding Method and Device for Repeatedly Decoding First and Second Encoded Data
Cache Memory Device
Esd Protection Devices with Scr Structures for Semiconductor Integrated Circuits
Driver Circuit and Display Device
Etching apparatus and etching method
Application:
11/252,805 →
Publication:
US 2006/0086461
Etching Apparatus
A/D Conversion Apparatus
Semiconductor Device Including Chips with Electrically-Isolated Test Elements and Its Manufacturing Method
Liquid Crystal Display for Implmenting Improved Inversion Driving Technique
Method for Manufacturing Electonic Device
Semiconductor Device Including a Capacitor Element
Apparatus and Method for Driving Display Panels for Reducing Power Consumption of Grayscale Voltage Generator
Method for Manufacturing Electronic Device
Semiconductor Integrated Device for Preventing Breakdown and Degradation of a Gate Oxide Film Caused by Charge-Up in Manufacturing Steps Thereof, Design Method Thereof, Designing Apparatus Method Thereof, and Manufacturing Apparatus Thereof
Semiconductor Device
Semiconductor Device Including Dummy Patterns
Semiconductor Device and Testing Method for Semiconductor Device
Cmos Current Mirror Circuit and Reference Current/Voltage Circuit
Semiconductor Device with Vertical Mosfet and Method of Manufacturing the Same
Microcomputer Chip with Function Capable of Supporting Emulation
Semiconductor Device and Method for Manufacturing Same
Solid State Image Pick-Up Device for Imaging an Object Placed Thereon
Method of Manufacturing Semiconductor Apparatus and Method of Forming Viscous Liquid Layer
Semiconductor Device
Semiconductor Device with Leakage Current Compensating Circuit
Multi-Processing System and Multi-Processing Method
Semiconductor Apparatus and Method of Manufacturing the Same
Semiconductor Memory Device and Refresh Control Method
Method and Driving Circuit for Driving Liquid Crystal Display, and Portable Electronic Device
Wiring Board Having Connecting Wiring Between Electrode Plane and Connecting Pad
Voltage Comparator Circuit with Symmetric Circuit Topology
Semiconductor Integrated Circuit
Video Signal Multiplexer, Video Signal Multiplexing Method, and Picture Reproducer
Semiconductor Memory Device
Pll Circuit with Deadlock Detection Circuit
Error Detecting Code Addition Circuit, Error Detection Circuit and Method, and Disc Apparatus
Scrambler, Descrambler and Method, and Disc Apparatus
Display Unit
Data Authentication Circuit, Battery Pack and Portable Electronic Device
Semiconductor Unit
Logic Circuit
Compressed Stream Decoding Apparatus and Method
Phase Difference Detection Circuit, Phase Difference Detecting Method, Optical Disk Drive, and Optical Disk Drive Controlling Method
Semiconductor Device with Termination Resistor Circuit
Spread Spectrum Clock Generating Apparatus
Apparatus and Method for Protecting from Illegal Copy
Semiconductor Device,Having a Through Electrode Semiconductor Module Employing Thereof and Method for Manufacturing Semiconductor Device Having a Through Electrode
Semiconductor Integrated Device, Method of Designing Semiconductor Integrated Device, Device for Designing the Same, and Program
Driver Circuit of Display Device
Liquid Crystal Driving Device, Liquid Crystal Display Device, and Liquid Crystal Driving Method
Over-Sampling a/D Converting Circuit
Printer and Printing Method
Semiconductor Apparatus and Clock Generation Unit
Video Signal Processing Apparatus and Video Signal Processing Method
Semiconductor Device with Clock Failure Detection Circuitry
Host Device, Device Unit, Communication System, and Data Transmission/Reception Method
Canceller Device and Data Transmission System
Readout Circuit and Nonvolatile Semiconductor Memory Device
Differential Amplifier and Data Driver Employing the Differential Amplifier
Controller Driver and Liquid Crystal Display Apparatus Using the Same
Bias Circuit
Charge-Pump Circuit and Boosting Method for Charge-Pump Circuit
Logic Circuit and Word-Driver Circuit
Controller Driver, Liquid Crystal Display Apparatus Using the Same, and Liquid Crystal Driving Method
Synchronous Detector
Stream Processor and Information Processing Apparatus
Semiconductor Device with Test Circuit and Test Method of the Same
Switched Capacitor Circuit Type Digital/Analog Converter Capable of Suppressing Change of Setting Error
Semiconductor Storage Device and Pseudo Sram
Semiconductor Storage Device
Semiconductor Storage Device
Semiconductor Device and Method of Fabricating the Same
Electronic Circuit Board
Integrated Circuit Apparatus
Exposure Apparatus
Process for Manufacturing a Semiconductor Device Comprising a Metal-Compound Film
Data line driver including a plurality of cascaded data line driver sections having long sampling period of video signals
Application:
11/324,551 →
Publication:
US 2006/0146001
Driver Circuit
Voltage Supply Circuit, Power Supply Circuit, Microphone Unit Using the Same, and Microphone Unit Sensitivity Adjustment Method
Voltage Supply Circuit and Microphone Unit
Semiconductor Device Featuring Copper Wiring Layers of Different Widths Having Metal Capping Layers of Different Thickness Formed Thereon, and Method for Manufacturing the Same
Related Assignments
(19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 5, 2005
From: MASUOKA, SADAAKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017069/0001 →
Assignment of Assignor's Interest
Oct 6, 2005
From: MIWA, KIYOTAKA; KARIYA, NAYUTA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017079/0977 →
Assignment of Assignor's Interest
Oct 6, 2005
From: IWAKI, TAKAYUKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017071/0221 →
Assignment of Assignor's Interest
Oct 7, 2005
From: OHKUBO, HIROAKI; NAKASHIBA, YASUTAKA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017079/0141 →
Assignment of Assignor's Interest
Oct 12, 2005
From: SAKAGUCHI, MAKOTO
To: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
Reel/Frame 017092/0489 →
Assignment of Assignor's Interest
Oct 12, 2005
From: MORISHITA, YASUYUKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017104/0704 →
Assignment of Assignor's Interest
Oct 12, 2005
From: YANO, KATSUHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017094/0936 →
Assignment of Assignor's Interest
Oct 12, 2005
From: FURUMIYA, MASAYUKI; KIKUTA, KUNIKO; YAMAMOTO, RYOTA; NAKAYAMA, MAKOTO
To: NEC CORPORATION
Reel/Frame 017088/0327 →
Assignment of Assignor's Interest
Oct 13, 2005
From: ORIO, MASAO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017087/0979 →
Assignment of Assignor's Interest
Oct 18, 2005
From: MIURA, MAKOTO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017112/0552 →
Assignment of Assignor's Interest
Oct 19, 2005
From: INADA, ATSURO; UENO, KAZUHIKO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017117/0764 →
Assignment of Assignor's Interest
Oct 20, 2005
From: INADA, ATSURO; UENO, KAZUHIKO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017122/0363 →
Assignment of Assignor's Interest
Nov 1, 2005
From: ANJO, KENICHIRO; TOGAWA, KATSUMI; SASAKI, RYOKO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 016964/0777 →
Assignment of Assignor's Interest
Nov 21, 2005
From: KOBAYASHI, KEIKO; TAKAHASHI, YOICHI; OOBA, TOMOTAKE; HIGUCHI, FUJIO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017050/0392 →
Assignment of Assignor's Interest
Jan 9, 2006
From: TAKAHASHI, YOICHI; OOBA, TOMOTAKE; HIGUCHI, FUJIO; SAITOU, AKIRA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017174/0879 →
Assignment of Assignor's Interest
Jan 23, 2006
From: HIRATA, MORIHISA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017484/0155 →
Assignment (Correct Recordation at Reel 17088, Frame 327) Correcting Assignee's Name
Mar 10, 2006
From: FURUMIYA, MASAYUKI; KIKUTA, KUNIKO; YAMAMOTO, RYOTA; NAKAYAMA, MAKOTO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017331/0248 →
Assignment of Assignor's Interest
Apr 5, 2006
From: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017434/0941 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →