IP Library Granted Patent US 7,254,081
Granted Patent B2
US 7,254,081 · App. 11/274,220 · Granted Aug 7, 2007

Semiconductor memory device

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Quick Facts
Patent No.
US 7,254,081
App. No.
11/274,220
Granted
Aug 7, 2007
Kind
B2
Abstract

A semiconductor memory device has: a word driver configured to apply a driving voltage to a word line connected to a memory cell; and an internal power supply circuit configured to supply the driving voltage to the word driver and to apply a substrate voltage to back gates of transistors included in the word driver. The internal power supply circuit controls the driving voltage and the substrate voltage independently of each other. In a read operation, the internal power supply circuit constantly supplies the substrate voltage, while turns on and off supply of the driving voltage.

Claims (48)

1. A semiconductor memory device comprising:

a word driver configured to apply a driving voltage to a word line connected to a memory cell; and

an internal power supply circuit configured to supply said driving voltage to said word driver and to apply a substrate voltage to back gates of transistors included in said word driver,

wherein said internal power supply circuit controls said driving voltage and said substrate voltage independently of each other, and

wherein in a read operation, said internal power supply circuit constantly supplies said substrate voltage, while turning on and off supply of said driving voltage.

2. The semiconductor memory device according to claim 1 , wherein said transistors include a P-channel transistor in a final stage for outputting said driving voltage to said word line.

3. The semiconductor memory device according to claim 2 , wherein said internal power supply circuit comprises:

a first power supply switch connected to said word driver through a first power supply interconnection; and

a second power supply switch connected to said word driver through a second power supply interconnection,

wherein said first power supply switch constantly supplies said substrate voltage to said first power supply interconnection, and said second power supply switch supplies said driving voltage to said second power supply interconnection in response to a select signal.

4. The semiconductor memory device according to claim 1 , wherein said memory cell comprises a non-volatile memory cell.

5. A semiconductor memory device comprising:

a word driver configured to apply a driving voltage to a word line connected to a memory cell; and

an internal power supply circuit configured to supply said driving voltage to said word driver and to apply a substrate voltage to back gates of transistors included in said word driver,

wherein said internal power supply circuit controls said driving voltage and said substrate voltage independently of each other, and

wherein said word driver includes a level shifter, and said transistors include a P-channel transistor of said level shifter.

6. The semiconductor memory device according to claim 5 , wherein

said internal power supply circuit supplies said driving voltage to a source of said P-channel transistor of said level shifter and applies said substrate voltage to a well in which said P-channel transistor is formed, and

said word driver applies a voltage of said source to said word line in response to a word line select signal which designates said word line.

7. The semiconductor memory device according to claim 6 , wherein said internal power supply circuit comprises:

a first power supply switch connected to said word driver through a first power supply interconnection; and

a second power supply switch connected to said word driver through a second power supply interconnection,

wherein said first power supply switch constantly supplies said substrate voltage to said first power supply interconnection, and said second power supply switch supplies said driving voltage to said second power supply interconnection in response to a select signal.

8. A semiconductor memory device comprising:

a word driver configured to apply a driving voltage to a word line connected to a memory cell; and

an internal power supply circuit configured to supply said driving voltage to said word driver and to apply a substrate voltage to back gates of transistors included in said word driver,

wherein said internal power supply circuit controls said driving voltage and said substrate voltage independently of each other, and

wherein said internal power supply circuit comprises:

a first power supply switch connected to said word driver through a first power supply interconnection; and

a second power supply switch connected to said word driver through a second power supply interconnection,

wherein said first power supply switch constantly supplies said substrate voltage to said first power supply interconnection, and said second power supply switch supplies said driving voltage to said second power supply interconnection in response to a select signal.

9. The semiconductor memory device according to claim 8 , wherein said first power supply interconnection is connected with a plurality of second power supply switches each of which corresponds to said second power supply switch.

10. The semiconductor memory device according to claim 9 , wherein

said first power supply interconnection is connected with a plurality of word drivers each of which corresponds to said word driver,

said plurality of word drivers are respectively connected to said plurality of second power supply switches,

said first power supply switch constantly supplies said substrate voltage to said plurality of word drivers through said first power supply interconnection,

each of said plurality of second power supply switches receives said substrate voltage constantly from said first power supply switch, and supplies said substrate voltage as said driving voltage to said second power supply interconnection in response to said select signal.

11. The semiconductor memory device according to claim 8 , further comprising a plurality of memory cell blocks arranged in an array, wherein

said word driver is provided in each of said plurality of memory cell blocks, and

said select signal comprises a block select signal which designates a memory cell block of said plurality of memory cell blocks, said memory cell block including said memory cell to be accessed.

12. A semiconductor memory device comprising:

a word line connected to a memory cell; and

a word driver having a first transistor and a second transistor configured to drive said word line,

wherein said first transistor has a back gate to which a first voltage is applied before a read address transition, said first voltage being also applied to said word line when said word line is selected in a read operation, and

wherein said second transistor has a back gate to which a second voltage is applied before said read address transition, said second voltage being also applied to said word line when said word line is unselected in said read operation.

13. The semiconductor memory device according to claim 12 , wherein a voltage for driving said word driver is settled down after said read address transition.

14. The semiconductor memory device according to claim 12 , wherein said memory cell comprises a non-volatile memory cell.

15. The semiconductor memory device according to claim 12 , wherein said voltage of back gates of transistors included in said word driver remains unchanged during said read address transition.

Assignments (3)
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
CHANGE OF NAME Recorded Nov 11, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025346/0877 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 9, 2006
From: SUGAWARA, HIROSHI; WATANABE, KAZUO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017171/0037 →