Patent Assignment
Reel/Frame 017266/0236
Assignment of Assignor's Interest
Recorded: 2005-11-21
Pages: 4
Assignors
RAMANATHAN, SHRIRAM
Executed: 2005-11-18
KIM, SARAH E.
Executed: 2005-11-18
MORROW, PATRICK R.
Executed: 2005-11-18
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
3D Integrated Circuits Using Thick Metal for Backside Connections and Offset Bumps
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.