Patent Assignment
Reel/Frame 017274/0259
Assignment of Assignor's Interest
Recorded: 2005-11-28
Pages: 3
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO 105-8001, JAPAN
Covered Property
(1)
Interface Module for Connecting Lsi Packages, and Lsi-Incorporating Apparatus