Patent Assignment
Reel/Frame 017315/0927
Assignment of Assignor's Interest
Recorded: 2005-11-30
Pages: 3
Assignors
YUN, CHONGMAN
Executed: 2005-11-28
OH, KWANG HOON
Executed: 2005-11-28
LEE, KYU HYUN
Executed: 2005-11-28
KIM, YOUNGCHULL
Executed: 2005-11-28
Assignee
FAIRCHILD KOREA SEMICONDUCTOR, LTD.
(420-711) 82-3 DODANG-DONG, WONMI-GU, BUCHEON SI, GYEOONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Power Semiconductor Device Using Silicon Substrate as Field Stop Layer and Method of Manufacturing the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 2, 2017
From: FAIRCHILD KOREA SEMICONDUCTOR, LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044361/0205 →
Patent Security Agreement
Jul 11, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 046530/0460 →
Release of Security Interest in Patents Recorded at Reel 046530, Frame 0460
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064075/0001 →