Patent Assignment
Reel/Frame 017326/0667
Assignment of Assignor's Interest
Recorded: 2005-12-09
Pages: 2
Assignor
NAKAMURA, TSUNEHIKO
Executed: 2005-10-11
Assignee
KYOCERA CORPORATION
6, TAKEDA TOBADONO-CHO, FUSHIMI-KU, KYOTO-SI, KYOTO 612-8501, JAPAN
Covered Property
(1)
Heater, Wafer Heating Apparatus and Method for Manufacturing Heater