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Patent Assignment
Reel/Frame 017327/0240

Assignment of Assignor's Interest

Recorded: 2005-12-08 Pages: 6
Assignors
ABE, MITSUGU
Executed: 2005-08-24
NAMBU, NOBUYOSHI
Executed: 2005-08-24
ITO, OSAMU
Executed: 2005-08-24
OGITSU, MASAAKI
Executed: 2005-08-24
INOMATA, KAZUO
Executed: 2005-08-24
Assignee
NOMURA MICRO SCIENCE CO., LTD.
2-9-8, OKADA, ATSUGI-SHI, KANAGAWA 243-0021, JAPAN
Covered Property (1)
Material for Purification of Semiconductor Polishing Slurry, Module for Purification of Semiconductor Polishing Slurry and Process for Producing Semiconductor Polishing Slurry
Patent: 7,625,262 →
Application: 10/549,294 →
Publication: US 2006/0205325