IP Library › Assignment 017355/0806
Patent Assignment
Reel/Frame 017355/0806

Assignment of Assignor's Interest

Recorded: 2005-12-21 Pages: 3
Assignors
LEE, SUNG JUN
Executed: 2005-12-09
HWANG, WOONG LIN
Executed: 2005-12-09
CHOI, SANG HYUN
Executed: 2005-12-09
LIM, CHANG HYUN
Executed: 2005-12-09
PARK, HO JOON
Executed: 2005-12-09
CHOI, SEOG MOON
Executed: 2005-12-09
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETON-3-DONG, YOUNGTONG-KU, SUWON, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Led Package Using Si Substrate and Fabricating Method Thereof
Patent: 7,582,496 →
Application: 11/312,412 →
Publication: US 2006/0220036
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →