Assignment of Assignor's Interest

Recorded: 2006-03-23 Pages: 2

Assignor

SAEKI, YOSHIHIRO

Executed: 2006-03-03

Assignee

OKI ELECTRIC INDUSTRY CO., LTD.

7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, 105-8460, JAPAN

Covered Property (1)

Method for Laminating Chips and Method for Manufacturing Semiconductor Device Using the Same

Application: 11/276,766 →

Publication: US 2006/0207086

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.