Patent Assignment
Reel/Frame 022092/0903
CHANGE OF NAME
Recorded: 2009-01-08
Received: 2009-01-13
Pages: 15
Assignor
OKI ELECTRIC INDUSTRY CO., LTD.
Executed: 2008-10-01
Assignee
OKI SEMICONDUCTOR CO., LTD.
550-1 HIGASHIASAKAWA-CHO, HACHIOJI-SHI, TOKYO, JPX, 193-8550, JAPAN
Covered Applications
(100)
SEMICONDUCTOR MEMORY DEVICE WITH REDUNDANCY CIRUIT
App. No. 12/133,113
→
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND METHOD FOR ETCHING THE SAME
App. No. 12/110,479
→
INPUT/OUTPUT CIRCUIT AND INPUT/OUTPUT DEVICE
App. No. 12/039,942
→
Blood type checking reagent containing lectin
App. No. 12/068,474
→
SEMICONDUCTOR DEVICE WHICH INCLUDES A CAPACITOR AND AN INTERCONNECTION FILM COUPLED TO EACH OTHER AND A MANUFACTURING METHOD THEREOF
App. No. 12/014,331
→
CHEMICAL CALIBRATION METHOD AND SYSTEM
App. No. 12/006,246
→
METHOD OF PRODUCING ACCELERATION SENSOR CHIP PACKAGE
App. No. 12/005,370
→
SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF CIRCUIT ELEMENT CHIPS AND A MANUFACTURING METHOD THEREOF
App. No. 11/947,335
→
METHOD FOR MANUFACTURING DIFFRACTIVE OPTICAL ELEMENT
App. No. 11/913,074
→
SILICON-ON-INSULATOR DIFFERENTIAL AMPLIFIER CIRCUIT
App. No. 11/877,207
→
ACCELERATION SENSOR CHIP PACKAGE AND METHOD OF PRODUCING THE SAME
App. No. 11/907,877
→
STEP-DOWN POWER SUPPLY
App. No. 11/863,698
→
Semiconductor chip package and method manufacturing method thereof
App. No. 11/898,449
→
SEMICONDUCTOR DEVICE AND PROCESS FOR MANUFACTURING THE SAME
App. No. 11/889,100
→
MANUFACTURING METHOD OF AN ACCELERATION SENSING DEVICE
App. No. 11/831,232
→
ACCELERATION SENSOR
App. No. 11/878,852
→
METHOD OF FABRICATING A SEMICONDUCTOR CHIP PACKAGE
App. No. 11/826,468
→
Semiconductor device and method for fabricating the same
App. No. 11/819,221
→
DIGITAL-TO-ANALOG CONVERTER WITH SECONDARY RESISTOR STRING
App. No. 11/812,293
→
METHOD FOR FABRICATING A THREE-DIMENSIONAL ACCELERATION SENSOR
App. No. 11/797,162
→
SEMICONDUCTOR MEMORY DEVICE WITH REDUNDANCY CIRCUIT
App. No. 11/785,961
→
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
App. No. 11/785,813
→
SEMICONDUCTOR WAFER AND MANUFACTURING METHOD THEREOF
App. No. 11/783,669
→
Semiconductor device
App. No. 11/730,178
→
SEMICONDUCTOR ELEMENT HOLDING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURED USING THE SAME
App. No. 11/717,682
→
DEMODULATOR FOR DEMODULATING PULSE POSITION MODULATED SIGNAL
App. No. 11/715,435
→
Method of manufacturing semiconductor device
App. No. 11/657,641
→
METHOD OF PRODUCING THE SAME
App. No. 11/638,551
→
LEVEL SHIFTER CIRCUIT WITH STRESS TEST FUNCTION
App. No. 11/637,084
→
MULTI-MODE OPTICAL COHERENCE DEVICE AND FABRICATION METHOD THEREOF
App. No. 11/607,992
→
DECISION TIMING SYNCHRONOUS CIRCUIT AND RECEIVER CIRCUIT
App. No. 11/606,999
→
SEMICONDUCTOR CHIP PACKAGE AND FABRICATION METHOD THEREOF
App. No. 11/582,565
→
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
App. No. 11/543,196
→
FIELD EFFECT TRANSISTOR COMPRISING COMPOUND SEMICONDUCTOR
App. No. 11/528,321
→
FSK SIGNAL DETECTOR FOR DETECTING FSK SIGNAL THROUGH DIGITAL PROCESSING
App. No. 11/524,951
→
SEMICONDUCTOR DEVICE
App. No. 11/533,370
→
Operational processor with a status information register serving as a data register
App. No. 11/515,905
→
METHOD AND A SYSTEM FOR ESTABLISHING A CONNECTION WITH IDENTIFICATION AND GROUP INFORMATION
App. No. 11/513,303
→
MANUFACTURING METHOD FOR PACKAGED SEMICONDUCTOR DEVICE
App. No. 11/511,267
→
PROCESS OF MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 11/509,652
→
Synchronous control apparatus for initial synchronization when receiving a wireless signal
App. No. 11/507,494
→
METHOD FOR MAUFACTURING SEMICONDUCTOR DEVICE
App. No. 11/501,691
→
ALIGNMENT ERROR MEASURING MARK AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
App. No. 11/499,699
→
Polymer removing apparatus and method for cleaning inside thereof
App. No. 11/499,781
→
DRIVING POWER-SUPPLY CIRCUIT
App. No. 11/494,765
→
Semiconductor device
App. No. 11/492,879
→
SEMICONDUCTOR DEVICE
App. No. 11/488,190
→
Relaying radio communication between a base station and a mobile terminal using a control channel at a longer time interval
App. No. 11/481,949
→
WIRELESS LAN SYSTEM MAKING QUALITY OF COMMUNICATION IMPROVE AND A COMMUNICATION METHOD THEREFOR
App. No. 11/481,248
→
SEMICONDUCTOR CHIP PACKAGE
App. No. 11/478,850
→
Method for modifying surface of substrate and method for manufacturing semiconductor device
App. No. 11/475,242
→
System using bus arbiter to power down
App. No. 11/474,445
→
SEMICONDUCTOR DEVICE
App. No. 11/425,709
→
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 11/425,708
→
METHOD FOR MANUFACTURING ELEMENT ISOLATION STRUCTURAL SECTION
App. No. 11/453,993
→
AN AUTOMATIC DESIGN METHOD INCLUDING AUTOMATIC PROCESSING FOR EQUALIZING SPACING WIRING AND AUTOMATIC DESIGNING APPARATUS THEREOF
App. No. 11/444,528
→
PLL CONTROLLER APPLYING A MULTIPLIER COEFFICIENT APPROPRIATE FOR A PHASE ERROR, AND A METHOD THEREFOR
App. No. 11/442,999
→
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MOS FIELD EFFECT TRANSISTOR
App. No. 11/443,357
→
PHASE DIFFERENCE SPECIFYING METHOD
App. No. 11/420,809
→
FERROELECTRIC MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
App. No. 11/441,195
→
METHOD FOR CUTTING JUNCTION BOARD, AND CHIP
App. No. 11/415,148
→
CIRCUIT AND METHOD FOR TESTING ANALOG-DIGITAL CONVERTER
App. No. 11/415,149
→
MEMORY ARRAY CIRCUIT WITH TWO-BIT MEMORY CELLS
App. No. 11/408,114
→
SEMICONDUCTOR DEVICE HAVING STRESS RELAXATION SECTIONS
App. No. 11/406,232
→
SEMICONDUCTOR DEVICE
App. No. 11/393,874
→
MEMORY CELL STRUCTURE AND SEMICONDUCTOR MEMORY DEVICE
App. No. 11/277,923
→
METHOD OF FABRICATING SEMICONDUCTOR DEVICE INCLUDING FORMING A PROTECTIVE LAYER AND REMOVING AFTER ETCHING A TRENCH
App. No. 11/391,353
→
WIRELESS COMMUNICATIONS APPARATUS MADE OPERATIVE IN DEPENDENT UPON A RECEIVED SIGNAL STRENGTH
App. No. 11/391,328
→
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
App. No. 11/277,926
→
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING BONDING SHEET
App. No. 11/277,928
→
A METHOD FOR MANUFACTURING A THROUGH CONDUCTOR
App. No. 11/387,780
→
SEMICONDUCTOR CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
App. No. 11/387,690
→
SEMICONDUCTOR INTEGRATED CIRCUIT
App. No. 11/384,361
→
CHIP ENABLE CONTROL CIRCUIT, MEMORY CONTROL CIRCUIT, AND DATA PROCESSING SYSTEM
App. No. 11/378,391
→
SILICON ON SAPPHIRE WAFER
App. No. 11/377,394
→
SEMICONDUCTOR DEVICE
App. No. 11/276,825
→
OPTICAL ELEMENT MANUFACTURING METHOD
App. No. 11/374,117
→
METHOD FOR LAMINATING CHIPS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
App. No. 11/276,766
→
Semiconductor device including protection circuit in silicon layer of SOI substrate
App. No. 11/374,172
→
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 11/276,731
→
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
App. No. 11/370,892
→
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 11/370,891
→
NONVOLATILE MEMORY
App. No. 11/369,983
→
CLOCK CONTROL CIRCUIT THAT GENERATES AND SELECTS ONE OF A DIVIDED CLOCK SIGNAL AND A MULTIPLIED CLOCK SIGNAL AS A BUS CLOCK SIGNAL
App. No. 11/368,417
→
METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENTAL DEVICE FORMING AN AMORPHOUS HIGH DIELECTRIC FILM AND AN AMORPHOUS SILICON FILM
App. No. 11/366,384
→
METHOD FOR FORMING PHOTORESIST PATTERN AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 11/366,385
→
SEMICONDUCTOR DEVICE, STACKED STRUCTURE, AND MANUFACTURING METHOD
App. No. 11/365,842
→
SEMICONDUCTOR DEVICE HAVING A FRAME PORTION AND AN OPENING PORTION WITH MOUNTABLE SEMICONDUCTOR CHIPS THEREIN
App. No. 11/364,008
→
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
App. No. 11/364,175
→
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
App. No. 11/276,407
→
METHOD AND APPARATUS FOR GENERATING LAYOUT PATTERN
App. No. 11/362,949
→
ELECTRO-STATIC DISCHARGE PROTECTION CIRCUIT AND SEMICONDUCTOR DEVICE HAVING THE SAME
App. No. 11/276,403
→
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND METHOD FOR REGULATING SPEED OF FORMING AN INSULATING FILM
App. No. 11/276,404
→
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 11/276,402
→
ACCELERATION SENSOR CHIP
App. No. 11/362,176
→
SEMICONDUCTOR DEVICE HAVING A PACKAGE BASE WITH AT LEAST ONE THROUGH ELECTRODE
App. No. 11/360,570
→
BIAS CIRCUIT FOR A WIDEBAND AMPLIFIER DRIVEN WITH LOW VOLTAGE
App. No. 11/359,370
→
SEMICONDUCTOR DEVICE HAVING SIDEWALL PORTION WITH SILICON NITRIDE FILM FORMED ABOVE LAYER AND SEPARATED FROM REGION ABOVE PRIMARY INSULATING FILM VIA OXIDE FILM, WHERE THE PORTION IS FORMED ON SIDEWALL OF GATE ELECTRODE
App. No. 11/276,185
→
FERROELECTRIC MEMORY
App. No. 11/356,167
→
Method of forming alignment mark and method of manufacturing semiconductor device
App. No. 11/276,116
→