IP Library Patent Application 11797162
Patent Application
App. No. 11/797,162

Method for fabricating a three-dimensional acceleration sensor

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Quick Facts
Patent No.
US None
App. No.
11/797,162
Abstract

According to the present invention, a method for fabricating a three-dimensional acceleration sensor, comprising: providing a semiconductor substrate having first and second surfaces; forming an insulating layer on the first surface of the semiconductor substrate; forming an active layer on the insulating layer; forming a plurality of openings on the active layer at a first region, which is to be located above a movable mass with a predetermined space; selectively removing the insulating layer located under the first region in a wet-etching process through the plurality of openings; and selectively removing the active layer to form a groove separating the first region from a movable mass.

Claims (30)

1 - 29 . (canceled)

30 . A method for fabricating a three-dimensional acceleration sensor, comprising:

providing a semiconductor substrate having first and second surfaces;

forming an insulating layer on the first surface of the semiconductor substrate;

forming an active layer on the insulating layer;

selectively removing the semiconductor substrate so as to define a first boundary of a movable mass;

providing a glass plate on the second surface of the semiconductor substrate;

forming a plurality of first openings on the active layer at a first region;

forming a plurality of second openings on the active layer at a second region adjacent the first region so that the second openings have larger areas than the first openings;

selectively removing the insulating layer located under the first region in a wet-etching process through the plurality of the first openings; and

after the step of removing the insulating layer located under the first region, selectively removing the insulating layer located under the second region in a wet-etching process through the plurality of the second openings.

31 . The method for fabricating a three-dimensional acceleration sensor, according to claim 30 , wherein

the second openings are formed to separate the movable mass, a stationary frame, beams and the stoppers from each other.

32 . The method for fabricating a three-dimensional acceleration sensor, according to claim 30 , wherein

the first region is a stopper which restricts over-move of the movable mass.

33 . The method for fabricating a three-dimensional acceleration sensor, according to claim 32 , wherein

the movable mass is shaped to have corners, and

the stopper comprises a plurality of members arranged around the corners of the movable mass.

34 . The method for fabricating a three-dimensional acceleration sensor, according to claim 30 , further comprising:

before forming the first and second openings, forming a detecting device to detect motion of the movable mass and output an electrical signal corresponding to a degree of the motion.

35 . The method for fabricating a three-dimensional acceleration sensor, according to claim 30 , wherein

the step of providing a glass plate is carried out before forming the plurality of openings on the active layer.

36 . The method for fabricating a three-dimensional acceleration sensor, according to claim 30 , wherein

the step of providing a glass plate is carried out in an anodic bonding process.

37 . The method for fabricating a three-dimensional acceleration sensor according to claim 30 , wherein

the glass plate is of pyrex glass.

38 . The method for fabricating a three-dimensional acceleration sensor according to claim 30 , wherein

the insulating layer is partly remained within the groove so that the insulating layer comprises an extended region, which extends from the movable mass toward the first region.

39 . The method for fabricating a three-dimensional acceleration sensor according to claim 30 , wherein

the first openings are arranged in a regular array manner.

Assignments (2)
CHANGE OF NAME Recorded Jan 8, 2009
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022092/0903 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2007
From: SAKAMOTO, AKIHIRO
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 019312/0655 →