Semiconductor device and method for fabricating the same
A semiconductor device according to the present invention includes a semiconductor substrate, which comprises a first surface on which an electrode pad is formed, and a second surface arranged at an opposite side of the first surface; an external terminal formed on the first surface of the semiconductor substrate and is electrically connected to the electrode pad; and a sealing resin which seals the first surface so that a surface of the external terminal is exposed. An outer edge of the second surface has a chamfered portion, a surface of which is inclined by substantially 45 degrees from the second surface.
1 . A semiconductor device, comprising:
a semiconductor substrate, which comprises a first surface on which an electrode pad is formed, and a second surface arranged at an opposite side of the first surface;
an external terminal formed on the first surface of the semiconductor substrate and is electrically connected to the electrode pad; and
a sealing resin which seals the first surface so that a surface of the external terminal is exposed, wherein
an outer edge of the second surface has a chamfered portion, a surface of which is inclined by substantially 45 degrees from the second surface.
2 . A semiconductor device according to claim 1 , wherein
the chamfered portion is formed to have a depth from the second surface of 50 to 150 μm (micro meters).
3 . A semiconductor device according to claim 2 , further comprising:
a rewiring extending from the first surface, in which one end of the rewiring is connected to the electrode pad and the other end is connected to the external terminal.
4 . A semiconductor device according to claim 3 , further comprising:
a ball electrode provided on the surface of the external terminal, which is exposed from the sealing resin.
5 . A semiconductor device according to claim 1 , wherein
the external terminal is a post electrode, which comprises a side surface covered with the sealing resin and a top surface exposed from the sealing resin.
6 - 19 . (canceled)