Assignment of Assignor's Interest

Recorded: 2007-06-26 Pages: 2

Assignor

UCHIDA, HIROKAZU

Executed: 2005-10-18

Assignee

OKI ELECTRIC INDUSTRY CO., LTD.

7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN

Covered Property (1)

Semiconductor device and method for fabricating the same

Application: 11/819,221 →

Publication: US 2007/0278678

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.